5SGXMABN3F45C4N

The 5SGXMABN3F45C4N is a Stratix V GX family field programmable gate array (FPGA) IC from Intel. It delivers very high logic density, substantial on‑chip memory, and a large I/O complement in a 1932‑ball FCBGA package.

Targeted at commercial-grade designs, this device provides 952,000 logic elements, approximately 53.25 Mbits of embedded memory, and 840 user I/O pins, making it suitable for high‑density, high‑I/O systems that require a compact surface‑mount package and low core voltage operation.

Key Features

• Core Logic — 952,000 logic elements for high-density implementation of complex digital functions and large-scale programmable logic.
• Embedded Memory — Approximately 53.25 Mbits of on‑chip RAM to support buffering, packet processing, and data‑intensive algorithms.
• I/O Capacity — 840 user I/Os to enable dense peripheral and board-level interfacing without external expanders.
• Stratix V GX Transceiver Series — Part of the Stratix V GX family; series documentation covers high‑speed transceiver support appropriate for serial interface applications.
• Power and Core Voltage — Core voltage supply range of 820 mV to 880 mV to match low‑voltage system power rails and design requirements.
• Package & Mounting — 1932‑BBGA FCBGA (supplier device package: 1932‑FBGA, FC 45×45) in a surface‑mount format for densely populated PCBs.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature for commercial product deployment.
• RoHS Compliance — Device is RoHS compliant for environmental and regulatory considerations.

Typical Applications

• High‑speed serial interfaces — Leverages the Stratix V GX family transceiver capabilities from the series documentation for serial connectivity and link aggregation.
• Compute acceleration & signal processing — Large logic element count and substantial on‑chip RAM support DSP, packet inspection, and hardware acceleration tasks.
• High‑density I/O aggregation — 840 I/Os enable protocol bridging, multi‑lane interface aggregation, and complex board I/O routing.
• Commercial system integration — Commercial temperature rating and surface‑mount FCBGA package suit volume products and compact system boards.

Unique Advantages

• High integration density: 952,000 logic elements combined with approximately 53.25 Mbits of embedded memory reduce the need for external logic and large external SRAM/DRAM banks in many designs.
• Expandable I/O capability: 840 user I/Os enable flexible interfacing to multiple subsystems and high‑pin‑count peripherals without external multiplexers.
• Low core voltage operation: 820 mV–880 mV supply range supports modern low‑voltage power architectures and helps optimize overall board power design.
• Compact, manufacturable package: 1932‑ball FCBGA (45×45) surface‑mount package provides a predictable BGA footprint for automated assembly in commercial production.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation for mainstream commercial deployments.
• Standards‑aware supply chain: RoHS compliance eases regulatory acceptance for commercial products.

Why Choose 5SGXMABN3F45C4N?

The 5SGXMABN3F45C4N combines very high logic density, significant embedded memory, and a large I/O count in a single Stratix V GX family FPGA, packaged for surface‑mount production. Its commercial temperature rating and RoHS compliance make it suitable for volume commercial products that need concentrated programmable logic and wide interfacing options.

This device is appropriate for engineering teams designing high‑density logic systems, complex I/O aggregation, and applications that reference the Stratix V GX series documentation for high‑speed serial/transceiver requirements.

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