5SGXMABN3F45C3N

The 5SGXMABN3F45C3N is a Stratix® V GX field programmable gate array (FPGA) IC designed for high-density programmable logic applications. It integrates a large logic fabric, substantial embedded RAM, and a high count of I/O pins to support complex digital designs and multi-channel interfaces.

Targeted at commercial-grade systems, this device delivers a combination of logic capacity, memory resources, and I/O density for applications that require system-level integration and scalable programmable performance.

Key Features

• Logic Capacity — 952,000 logic elements and 359,200 logic blocks provide substantial programmable fabric for complex designs and high gate counts.
• Embedded Memory — Approximately 53.25 Mbits of embedded memory for on-chip buffering, large look-up tables, and data storage close to logic.
• I/O Density — 840 I/O pins to support high-port-count interfaces and parallel connectivity to peripherals and subsystems.
• Package and Mounting — 1932-BBGA (FCBGA) package in a 45 × 45 mm supplier package; surface-mount device optimized for board-level integration.
• Power Supply — Core supply range of 820 mV to 880 mV for low-voltage core operation.
• Operating Grade and Temperature — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High‑density signal processing — Uses the large logic element count and on-chip memory to implement complex DSP pipelines and custom accelerators.
• Multi-channel I/O systems — Leverages 840 I/Os for boards requiring many parallel interfaces, multi-lane data capture, or extensive peripheral connectivity.
• Prototyping and system integration — Suited for developers implementing large-scale digital prototypes and integrating multiple functions into a single FPGA package.

Unique Advantages

• High logic density: 952,000 logic elements enable consolidation of large designs into a single device, reducing board-level complexity.
• Substantial embedded memory: Approximately 53.25 Mbits of on-chip RAM supports buffering, frame storage, and large state machines without external memory.
• Extensive I/O capability: 840 I/Os provide flexibility for high-throughput parallel interfaces and multiple peripheral connections.
• Compact, high‑pin package: 1932-BBGA (FCBGA) package allows high interconnect density in a surface-mount form factor suitable for complex PCBs.
• Commercial readiness: Commercial temperature grade and RoHS compliance align the device with mainstream electronics manufacturing requirements.
• Low-voltage core operation: Core supply range of 820–880 mV supports low-voltage FPGA core designs and power budgeting.

Why Choose 5SGXMABN3F45C3N?

This Stratix® V GX FPGA combines large logic capacity, abundant embedded memory, and a very high I/O count in a single commercial-grade BGA package, making it suitable for demanding digital designs that require dense integration. It is ideal for engineering teams building complex signal processing, multi-interface systems, and large-scale prototypes who need verifiable on-chip resources and package-level connectivity.

With RoHS compliance and surface-mount packaging, the 5SGXMABN3F45C3N supports mainstream manufacturing flows while delivering the on-chip resources required to reduce external components and simplify system architecture.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the 5SGXMABN3F45C3N.