5SGXMABN2F45I3LN

The 5SGXMABN2F45I3LN is a Stratix® V GX field programmable gate array (FPGA) IC in a 1932-BBGA FCBGA package. It delivers very high logic density with extensive I/O and on-chip memory for complex, programmable systems.

Designed and specified for industrial-grade operation, this device combines 952,000 logic elements and approximately 53 Mbits of embedded memory with a broad I/O complement and low-voltage core operation (820 mV–880 mV) for system designs that require high integration and long-term reliability.

Key Features

• High Logic Density — 952,000 logic elements (cells) to implement large-scale programmable logic, state machines, and custom datapaths.
• Embedded Memory — Approximately 53 Mbits of on-chip RAM to support buffering, packet processing, and data-intensive functions without external memory for many use cases.
• Extensive I/O — 840 user I/O pins for dense peripheral, memory, and signaling interfaces directly from the device.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• Low-Voltage Core Supply — Core supply range of 820 mV to 880 mV to align with modern low-voltage design requirements.
• Package and Mounting — 1932-BBGA (1932-FBGA, FC 45×45) package in a surface-mount format for robust board-level integration.
• Standards and Compliance — RoHS compliant as provided in the product data.
• Stratix V GX Family Characteristics — As a GX device within the Stratix V family, it shares the series’ electrical and switching characteristic definitions and available transceiver options documented for the family.

Typical Applications

• High-density packet processing — Use the large logic element count and embedded RAM to implement packet engines, protocol parsing, and buffering with extensive I/O connectivity.
• Protocol bridging and interface aggregation — 840 I/O pins enable multiple parallel interfaces and protocol converters on a single device.
• Complex control and automation systems — Industrial temperature rating and high logic/memory resources support demanding embedded control, sequencing, and preprocessing tasks.

Unique Advantages

• Significant on-chip resources: 952,000 logic elements and approximately 53 Mbits of embedded memory reduce dependence on external components and simplify system architecture.
• High I/O scalability: 840 I/O pins provide flexibility for dense board-level integration and multiple peripheral connections.
• Industrial robustness: Specified operation from −40 °C to 100 °C suits deployments in industrial environments that require extended temperature capability.
• Low-voltage operation: Core supply in the 820 mV–880 mV range supports low-power system architectures and modern power-domain designs.
• RoHS compliant: Meets common environmental compliance requirements for manufacturing and distribution.
• Proven device family framework: Built on the Stratix V GX series’ documented electrical and switching characteristics for consistent system-level design and evaluation.

Why Choose 5SGXMABN2F45I3LN?

The 5SGXMABN2F45I3LN positions itself for designs that need very high programmable logic capacity, large embedded memory, and a substantial I/O footprint while maintaining industrial temperature operation. Its low-voltage core and BBGA package enable compact, high-density board layouts.

It is well suited for engineering teams and procurement looking for a high-integration FPGA solution that offers on-chip resources to minimize external components, clear thermal and voltage operating windows, and compliance with RoHS requirements.

Request a quote or submit an inquiry to receive pricing and availability details for the 5SGXMABN2F45I3LN and to discuss how this device fits your design requirements.