5SGXMABN2F45I3G

The 5SGXMABN2F45I3G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a high-pin-count 1932-BBGA FCBGA package. This device provides large on-chip programmable logic and memory resources together with a high I/O count, and is supplied in an industrial temperature grade.

With 952,000 logic elements, approximately 53.25 Mbits of embedded RAM, and 840 I/Os, the device is suited to designs that require dense programmable logic, substantial on-chip buffering, and extensive external interfacing while operating across a wide industrial temperature and low-voltage supply range.

Key Features

• Core Logic  952,000 logic elements for large-scale programmable logic integration and complex design mapping.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for buffering, packet processing, and state storage.
• I/O Capacity  840 general-purpose I/Os to support broad external device connectivity and multi-domain interfacing.
• Package & Mounting  1932-BBGA FCBGA package (supplier package: 1932-FBGA, FC, 45×45) in a surface-mount form factor for high-pin-count PCB implementations.
• Power  Core voltage supply range 820 mV to 880 mV to match low-voltage core domains.
• Temperature Grade  Industrial operating range from -40 °C to 100 °C for designs targeting extended temperature environments.
• Compliance  RoHS-compliant to support standard environmental requirements.

Typical Applications

• High-density FPGA systems  Large programmable logic capacity and on-chip memory enable complex digital processing and custom accelerators.
• High I/O interface platforms  Extensive I/O count supports multi-channel data acquisition, board-level aggregation, and dense peripheral connectivity.
• Industrial and harsh-environment electronics  Industrial temperature rating and robust packaging make the device suitable for equipment operating across wide temperature ranges.

Unique Advantages

• High logic density: 952,000 logic elements support highly complex designs without immediate migration to multiple devices.
• Substantial embedded memory: Approximately 53.25 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state-storage tasks.
• Extensive I/O count: 840 I/Os simplify system integration by providing plentiful external interfacing options on a single device.
• Industrial temperature capability: Rated from -40 °C to 100 °C to meet thermal requirements for extended-environment applications.
• Compact, high-pin-count package: 1932-BBGA (1932-FBGA, 45×45) FCBGA packaging enables high-density board layouts while maintaining surface-mount assembly.
• Low-voltage core support: 820 mV–880 mV supply compatibility with modern low-voltage domains for efficient core operation.

Why Choose 5SGXMABN2F45I3G?

The 5SGXMABN2F45I3G offers a balanced combination of high logic capacity, significant on-chip memory, and very large I/O scalability in an industrial-grade Stratix V GX FPGA package. It is positioned for designs that demand dense programmable fabric, large embedded RAM, and broad external connectivity while operating across extended temperature ranges and low-voltage domains.

Designed and documented as part of the Stratix V family, this device fits development flows that require scalable FPGA resources and the ability to consolidate complex system functions into a single high-pin-count component.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGXMABN2F45I3G and to discuss how it fits your next high-density FPGA design.