5SGXMABN2F45C3N

The 5SGXMABN2F45C3N is a Stratix V GX field programmable gate array (FPGA) IC in a 1932-BBGA FCBGA package. This commercial-grade device delivers high logic capacity, substantial on‑chip memory, and a large I/O count for designs that require dense integration and extensive interfacing.

Key on‑device characteristics include 952,000 logic elements, approximately 53.2 Mbits of embedded memory, and 840 user I/Os, with a surface‑mount 1932‑FBGA (45×45) supplier package and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• High Logic Capacity — 952,000 logic elements to support large-scale, complex logic implementations in a single device.
• Embedded Memory — Approximately 53.2 Mbits of on‑chip RAM for buffering, data storage, and memory‑intensive functions without external memory.
• Extensive I/O — 840 user I/Os to support dense board-level connectivity and multi‑channel interfacing.
• Package and Mounting — 1932‑BBGA, FCBGA package (supplier: 1932‑FBGA, FC 45×45) with surface-mount mounting for high‑density PCB assembly.
• Core Voltage — Low-voltage operation with a specified supply range of 820 mV to 880 mV for the device core.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation to meet typical commercial application environments.
• Regulatory — RoHS compliant.

Typical Applications

• High‑density logic integration: Use where a single device must host extensive programmable logic, leveraging the 952,000 logic elements to consolidate functions.
• Memory‑intensive algorithms: Designs that require significant on‑chip buffering or embedded data storage can use the approximately 53.2 Mbits of RAM.
• High‑pin‑count interfacing: Systems needing broad peripheral and bus connectivity can take advantage of the 840 I/O pins.
• Commercial embedded systems: Applications operating in standard commercial temperature ranges can utilize this commercial‑grade FPGA (0 °C to 85 °C).

Unique Advantages

• Large single‑device integration: High logic and memory counts reduce the need for multi‑FPGA solutions, simplifying board design and lowering BOM complexity.
• Extensive external connectivity potential: 840 I/Os enable direct interfacing to many peripherals and high‑channel designs without additional I/O expanders.
• Compact package for dense designs: The 1932‑FBGA (45×45) package delivers high resource density in a surface‑mount footprint suitable for space‑constrained PCBs.
• Low core voltage operation: The 820–880 mV supply range supports modern low‑voltage system architectures.
• Regulatory readiness: RoHS compliance simplifies environmental and manufacturing requirements.

Why Choose 5SGXMABN2F45C3N?

The 5SGXMABN2F45C3N positions itself as a high‑capacity Stratix V GX FPGA for commercial designs that require extensive logic resources, substantial on‑chip memory, and a high number of I/Os in a single, surface‑mount FCBGA package. Its combination of 952,000 logic elements, approximately 53.2 Mbits of embedded RAM, and 840 I/Os helps streamline system architecture by consolidating functions and reducing external components.

Choose this device for projects that demand dense programmable logic, significant embedded memory resources, and broad interfacing capability within a commercial temperature envelope. Refer to the device datasheet for complete electrical and switching characteristics when preparing designs and procurement specifications.

Request a quote or submit an RFQ to initiate procurement and get pricing and availability for the 5SGXMABN2F45C3N.