5SGXMABN2F45C3G

The 5SGXMABN2F45C3G is a Stratix V GX field programmable gate array from Intel, presented in a 1932-BBGA FCBGA package for surface-mount applications. It provides very high logic density and on-chip memory to address designs that require large-scale programmable logic and significant embedded RAM.

With approximately 952,000 logic elements, roughly 53.25 Mbits of embedded memory, and 840 I/O, this commercial-grade device targets applications that need high integration density, many I/Os, and support for high-speed serial connectivity supported by the Stratix V GX transceiver architecture.

Key Features

• Core / Logic  Approximately 952,000 logic elements (logic cells) and 359,200 LABs/CLBs provide high-density programmable logic for complex designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive logic functions.
• I/O and Transceivers  840 I/O pins to support broad external interfacing. Stratix V GX family devices include high-speed transceiver capability (series-level support up to 14.1 Gbps per GX channel as documented in the Stratix V device datasheet).
• Power / Core Voltage  Core supply range specified at 820 mV to 880 mV for the device, enabling compatibility with low-voltage FPGA core domains.
• Package & Mounting  1932-ball BGA (FCBGA) package, supplier device package listed as 1932-FBGA, FC (45×45), designed for surface-mount PCB assembly.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance  RoHS-compliant for lead-free manufacturing environments.

Typical Applications

• High-speed serial connectivity  Designs that require multi-gigabit serial links can leverage the Stratix V GX transceiver capability for link-layer interfaces and protocol bridging.
• Large-scale programmable logic  Systems needing extensive custom logic, datapath parallelism, or deep pipeline implementations benefit from the device’s high logic element count and LAB resources.
• Memory-intensive processing  FPGA-based signal processing, buffering, and packet manipulation designs can use the approximately 53.25 Mbits of embedded RAM for local storage and low-latency data paths.
• High-pin-count I/O systems  Applications requiring broad external connectivity and parallel interfaces can use the 840 I/O pins to integrate multiple peripherals and buses.

Unique Advantages

• High integration density: Nearly 952,000 logic elements and 359,200 LABs/CLBs minimize the need for multiple devices in complex designs.
• Substantial embedded RAM: Approximately 53.25 Mbits of on-chip memory reduces reliance on external memory for many buffering and storage tasks.
• Extensive I/O capability: 840 I/O pins support broad interfacing options and high parallel throughput for system integration.
• Commercial temperature rating: Rated 0 °C to 85 °C to meet standard commercial application environments.
• Low-voltage core operation: Core supply range of 820 mV to 880 mV aligns with modern low-power core requirements.
• RoHS compliant: Supports lead-free manufacturing processes and environmental compliance needs.

Why Choose 5SGXMABN2F45C3G?

The 5SGXMABN2F45C3G combines very high logic density, large on-chip RAM, and broad I/O capacity in a single Stratix V GX device, making it suitable for designs that demand significant programmable resources and multi-gigabit connectivity. Its commercial-grade temperature range and RoHS compliance support standard production environments where high integration and reduced BOM complexity are priorities.

This part is appropriate for engineers and procurement teams building systems that require dense FPGA resources, plentiful I/O, and the series-level transceiver capabilities documented in the Stratix V device datasheet.

Request a quote or submit a purchase inquiry for part number 5SGXMABN2F45C3G to begin your procurement or evaluation process.