5SGXMABN2F45C2LNCV

The 5SGXMABN2F45C2LNCV is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers very high logic capacity and on-chip memory in a high‑pin‑count FCBGA package for demanding commercial applications.

With 952,000 logic elements, approximately 53.25 Mbits of embedded memory and 840 I/O, this device targets complex, high‑density programmable logic designs that require extensive I/O and embedded RAM while operating in commercial temperature environments.

Key Features

• Core Logic  952,000 logic elements and 359,200 logic array resources provide substantial capacity for large FPGA designs.
• Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM to support large buffers, state machines, and data‑intensive logic functions.
• I/O Density  840 user I/O pins support complex system interfacing and high‑pin‑count connectivity.
• Power  Core voltage supply range of 820 mV to 880 mV to match platform power delivery requirements.
• Package & Mounting  1932‑BBGA FCBGA package (supplier package: 1932‑FBGA, FC 45×45) in a surface‑mount form factor for compact, high‑pin‑count board designs.
• Operating Temperature & Grade  Commercial grade with an operating range of 0 °C to 85 °C for general commercial and enterprise deployments.
• Compliance  RoHS compliant construction for regulatory and manufacturing compatibility.

Typical Applications

• High‑density programmable logic systems — Implements large, complex logic and control fabrics using 952,000 logic elements and substantial on‑chip RAM.
• High‑I/O interfacing — Supports designs that require extensive external connectivity with 840 dedicated I/O pins.
• Embedded memory‑centric designs — Leverages approximately 53.25 Mbits of embedded RAM for buffering, packet handling, or data staging.

Unique Advantages

• Highly integrated capacity: Combines nearly one million logic elements with large embedded memory to reduce external component count and simplify complex system architectures.
• Extensive I/O reach: 840 I/O pins enable direct interfacing to multiple high‑pin subsystems and parallel buses without extensive glue logic.
• Compact, high‑pin package: 1932‑BBGA (FCBGA) packaging concentrates resources in a surface‑mount footprint suitable for dense PCB layouts.
• Commercial readiness: Designed for 0 °C to 85 °C operation and RoHS compliance for broad commercial and enterprise applications.
• Controlled core voltage: Narrow core supply range (820–880 mV) supports predictable power budgeting for system power delivery design.

Why Choose 5SGXMABN2F45C2LNCV?

The 5SGXMABN2F45C2LNCV positions itself as a high‑capacity Stratix V GX FPGA for designers needing very large logic and memory resources combined with extensive I/O in a single commercial‑grade device. Its packaging and pin count support dense system integration while the documented operating voltage and temperature range make power and thermal planning straightforward.

Choose this FPGA when your design demands substantial on‑chip resources, high I/O connectivity and a compact, surface‑mount package—delivering long‑term scalability within a commercial product roadmap backed by the Stratix V family documentation.

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