5SGXMABN2F45C2LN

The 5SGXMABN2F45C2LN is an Intel Stratix® V GX family FPGA offered in a commercial temperature grade. This device delivers very high logic capacity with 952,000 logic elements and approximately 53.248 Mbits of embedded RAM, plus 840 user I/Os in a 1932-BBGA (FCBGA) package.

With a documented Stratix V device datasheet covering electrical and switching characteristics for the GX series, this device is specified with a 0 °C to 85 °C operating range and a core supply window of 820 mV to 880 mV, making it suitable for demanding, high-density digital designs that require ample on-chip memory and large I/O counts.

Key Features

• Core Capacity — 952,000 logic elements provide substantial programmable logic resources for large FPGA designs.
• Logic Array Blocks — 359,200 logic array blocks (LABs) are provided as part of the device architecture.
• Embedded Memory — Approximately 53.248 Mbits of on-chip RAM to support deep buffering, large state machines, and embedded data storage.
• I/O Resources — 840 I/O pins enable extensive external interfacing and system connectivity.
• Power and Voltage — Core supply range specified at 820 mV to 880 mV to match precise power-rail designs.
• Package & Mounting — 1932-BBGA (FCBGA) supplier device package (1932-FBGA, FC 45×45) in a surface-mount form factor for high-density PCB integration.
• Temperature & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Compliance — RoHS compliant, supporting regulated-material requirements for many production programs.
• Series Documentation — Covered by the Stratix V device datasheet, which details electrical and switching characteristics for GX devices, including transceiver speed grade information.

Typical Applications

• High-density digital systems — Large logic capacity and extensive embedded RAM make this device suitable for complex FPGA-based processing pipelines.
• High-speed serial connectivity — Stratix V GX series documentation includes GX transceiver speed grade information, supporting designs that require high-speed serial channels.
• Large I/O integration — With 840 I/Os and a high-pin-count FCBGA package, the device fits applications needing broad external interfacing and parallel I/O channels.

Unique Advantages

• Extensive programmable resources: 952,000 logic elements enable dense, feature-rich designs without immediate porting to larger devices.
• Substantial on-chip memory: Approximately 53.248 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• High I/O count: 840 user I/Os allow flexible system partitioning and integration with many external peripherals and transceivers.
• Compact, manufacturable package: 1932-BBGA (FCBGA) surface-mount package supports high-density PCB layout while matching industrial assembly processes.
• Commercial temperature grade: Rated 0 °C to 85 °C for a wide range of customer electronic products operating in commercial environments.
• Regulatory readiness: RoHS compliance helps streamline environmental and materials compliance for production programs.

Why Choose 5SGXMABN2F45C2LN?

The 5SGXMABN2F45C2LN positions itself as a high-capacity Stratix V GX FPGA option for designs that require large programmable logic, extensive embedded memory, and a high I/O count in a single, surface-mount FCBGA package. Its documented operating conditions and series-level electrical and switching characteristics provide the engineering detail needed to plan power, thermal, and I/O designs.

This device is appropriate for customers developing complex digital systems and high-throughput interfaces who require the balance of logic density, on-chip RAM, and package I/O available from the Stratix V GX family, backed by the device datasheet documentation from Intel.

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