5SGXMABN1F45C2G

The 5SGXMABN1F45C2G is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, delivered in a 1932-BBGA FCBGA package for surface-mount applications. With approximately 952,000 logic elements and roughly 53 Mbits of embedded RAM, this commercial-grade device targets high-density designs that require large on-chip logic and memory resources alongside a high I/O count.

Key electrical operating parameters for this device include a core supply range of 870 mV to 930 mV and an ambient operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and documented in the Stratix V device datasheet for electrical and switching characteristics.

Key Features

• High Logic Capacity  Approximately 952,000 logic elements to implement complex digital functions and large FPGA designs.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM to support large buffering, look-up tables, and state storage.
• Extensive I/O  Up to 840 I/O pins for broad system connectivity and parallel interfacing options.
• Package and Mounting  1932-BBGA, FCBGA (supplier package 1932-FBGA, FC 45×45) in a surface-mount form factor suitable for modern PCB assembly.
• Power and Thermal  Core voltage supply of 870 mV–930 mV with an operating temperature range of 0 °C to 85 °C (commercial grade).
• Standards Compliance  RoHS compliant to meet common environmental and material requirements.
• Documented Electrical Characteristics  Detailed electrical and switching characteristics are provided in the Stratix V device datasheet covering operating conditions, I/O timing, and power consumption.

Typical Applications

• High-density digital processing  Large-scale logic resources and significant embedded RAM make this device suitable for complex FPGA-implemented algorithms and datapath processing.
• High-pin-count systems  With 840 I/Os, the device supports systems requiring extensive parallel interfaces, multi-channel connectivity, or large external memory busses.
• Prototyping and system integration  The combination of logic capacity and on-chip memory supports advanced prototyping and integration tasks for FPGA-centric designs.

Unique Advantages

• Large on-chip resources:  Approximately 952,000 logic elements and ~53 Mbits of embedded RAM reduce dependency on external logic and memory, simplifying board-level design.
• High I/O density:  840 I/Os enable diverse interfacing options and flexible system partitioning for complex hardware architectures.
• Compact, manufacturable package:  1932-BBGA (45×45) FCBGA package supports modern surface-mount assembly while delivering high routing density.
• Commercial temperature grade:  Rated for 0 °C to 85 °C operation to match commercial system requirements.
• RoHS compliant:  Meets environmental material standards for worldwide manufacturing and deployment.
• Supported by Stratix V documentation:  Electrical and timing characteristics are available in the Stratix V device datasheet for design and verification reference.

Why Choose 5SGXMABN1F45C2G?

The 5SGXMABN1F45C2G provides a high-density Stratix V GX FPGA option for designs that require substantial logic capacity, sizeable embedded memory, and a very large I/O footprint in a surface-mount BBGA package. Its defined supply voltage window and commercial temperature rating make it suitable for demanding commercial products where on-chip integration and system-level flexibility are priorities.

Backed by the Stratix V device documentation from Intel, this device is well-suited for engineering teams building complex FPGA-based systems that need clear electrical and switching specifications during design, verification, and integration.

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