5SGXMABK3H40I3N

The 5SGXMABK3H40I3N is a Stratix V GX Field Programmable Gate Array (FPGA) IC optimized for high-density, industrial-grade designs. It delivers large logic capacity and a substantial embedded memory footprint in a surface-mount FCBGA package suitable for complex system integration.

Designed for applications that require extensive on-chip logic, plentiful I/O, and robust operating conditions, this device is documented within the Stratix V device datasheet covering electrical and switching characteristics for the Stratix V family.

Key Features

• Core Density — 952,000 logic elements and 359,200 LABs provide a very high logic resource pool for large FPGA designs.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for large buffering, state storage, and data processing tasks.
• I/O — 696 user I/Os to support extensive peripheral and system-level interfacing without external multiplexers.
• Package & Mounting — 1517-BBGA FCBGA package (supplier package 1517-HBGA, 45×45) with surface-mount mounting for high-density board integration.
• Power — Core voltage supply range of 820 mV to 880 mV, enabling defined core-voltage operation consistent with the device’s electrical specifications.
• Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance — RoHS-compliant component meeting standard environmental requirements for lead-free assembly.

Typical Applications

• High-density signal processing — Leverages the large logic element count and embedded memory for DSP pipelines, accelerators, and algorithm-intensive tasks.
• Communications and networking — High I/O count and substantial on-chip resources support complex packet processing and protocol handling in networking equipment.
• Industrial control and automation — Industrial-grade temperature range and robust packaging make the device suitable for factory automation, motor control interfaces, and real-time control systems.
• Custom compute and prototyping — Large logic and memory resources enable consolidation of multiple functions and rapid hardware prototyping for system architects and FPGA developers.

Unique Advantages

• High logic capacity: 952,000 logic elements allow integration of large digital subsystems on a single device, reducing component count.
• Substantial embedded memory: Approximately 53.25 Mbits of RAM supports internal buffering and stateful processing without immediate dependence on external memory.
• Extensive I/O availability: 696 I/Os simplify board-level interfacing and help minimize external multiplexing and glue logic.
• Industrial-rated operation: −40 °C to 100 °C operating range enables deployment in harsh or temperature-variant environments.
• Compact high-density package: 1517-BBGA (45×45 supplier package) provides a space-efficient footprint for dense system designs.
• Standards-aligned manufacturing: RoHS compliance supports modern, lead-free assembly processes.

Why Choose 5SGXMABK3H40I3N?

The 5SGXMABK3H40I3N combines very high logic density, significant embedded memory, and abundant I/O in an industrial-grade FPGA package, making it a strong candidate for complex, space-constrained designs that must operate across a wide temperature range. Its documented electrical and switching characteristics are covered by the Stratix V device datasheet, providing the technical detail required for system-level integration and verification.

This device is well suited to engineering teams and procurement groups building high-performance compute, communications, industrial control, or prototype systems that benefit from consolidating functionality into a single, robust FPGA platform.

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