5SGXMABK3H40I3G

The 5SGXMABK3H40I3G is an Intel Stratix® V GX field-programmable gate array (FPGA) in a 1517-BBGA FCBGA package. It delivers very large logic capacity and embedded memory density with high I/O count and is specified as an industrial-grade device.

Key on-chip resources include 952,000 logic elements and approximately 53.2 Mbits of embedded RAM, with 696 I/O pins. The device is supplied in a 1517-HBGA (45×45) supplier package, operates from a core supply of 820 mV to 880 mV, and is rated for −40°C to 100°C operation.

Key Features

• Logic Capacity  952,000 logic elements for large, logic-dense designs.
• Embedded Memory  Approximately 53.2 Mbits of on-chip RAM to support large data buffering and local storage.
• I/O Density  696 I/O pins to support complex external interfacing and high-pin-count systems.
• Package  1517-BBGA, FCBGA package; supplier device package listed as 1517-HBGA (45×45) for compact, high-density board integration.
• Power Supply  Core voltage range of 820 mV to 880 mV to match low-voltage power architectures.
• Temperature & Grade  Industrial-grade device rated for −40°C to 100°C operation.
• Mounting  Surface-mount package suitable for modern PCB assembly processes.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density logic systems  Large-scale logic implementations that require a high count of logic elements and substantial on-chip RAM.
• High I/O platforms  Systems demanding dense external connectivity and parallel interfacing across many signals.
• Industrial equipment  Deployments that benefit from industrial temperature rating (−40°C to 100°C) and robust, surface-mount packaging.
• System prototyping and integration  Platform-level prototyping where large logic and memory resources simplify system partitioning and integration.

Unique Advantages

• Significant on-chip resources: 952,000 logic elements combined with approximately 53.2 Mbits of embedded RAM reduce reliance on external logic and memory components.
• High connectivity: 696 I/O pins enable complex peripherals and multi-channel interfaces without extensive external multiplexing.
• Industrial temperature support: Rated for −40°C to 100°C to meet extended-temperature deployment requirements.
• High-density package: 1517-BBGA (1517-HBGA supplier package, 45×45) provides high pin count in a surface-mount form factor for dense board layouts.
• Low-voltage core operation: 820–880 mV supply range supports integration with low-voltage power systems.
• Regulatory compliance: RoHS compliance for environmental and manufacturing considerations.

Why Choose 5SGXMABK3H40I3G?

This Stratix V GX FPGA is positioned for designs that require very large programmable logic capacity, substantial on-chip RAM, and high I/O density in an industrial-grade package. Its combination of 952,000 logic elements, approximately 53.2 Mbits of embedded memory, and 696 I/Os makes it suitable for system-level implementations where integration density and extended-temperature operation are priorities.

Engineers and procurement teams looking for a high-capacity FPGA in a compact, surface-mount 1517-BBGA package will find this device offers clear resource headroom and alignment with low-voltage core power architectures. The product’s specifications support scalability and robustness for demanding industrial deployments.

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