5SGXMABK3H40C4G

The 5SGXMABK3H40C4G is a Stratix® V GX field programmable gate array (FPGA) in a 1517-BBGA FCBGA package from Intel. It delivers a high-density programmable fabric with 952,000 logic elements, substantial on-chip memory, and a high I/O count for complex digital designs.

Designed for commercial-grade applications, this device is suited to system designs that require large programmable logic capacity, extensive embedded memory, and broad connectivity within a compact surface-mount package.

Key Features

• Stratix V GX architecture — Part of the Stratix V GX family, providing high-density programmable logic for advanced designs.
• Logic capacity — 952,000 logic elements to implement large-scale logic and processing functions.
• Embedded memory — Approximately 53 Mbits of on-chip RAM for buffers, FIFOs, and storage close to logic.
• I/O resources — 696 I/Os to support wide external interface integration and system-level connectivity.
• Package and mounting — 1517-BBGA, FCBGA (supplier package: 1517-HBGA, 45 × 45 mm) in a surface-mount form factor for dense board layouts.
• Power — Core voltage supply range of 820 mV to 880 mV to meet device operating requirements.
• Temperature and grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental — RoHS compliant.

Typical Applications

• High-density digital systems — Implement large programmable logic blocks and custom processing pipelines using the device’s 952,000 logic elements and on-chip RAM.
• Dense I/O integration — Leverage 696 I/Os for multi-interface systems, bridging many peripherals and external components on a single FPGA.
• Embedded memory-intensive designs — Use approximately 53 Mbits of embedded memory for buffering, packet processing, and local data storage.

Unique Advantages

• Large programmable fabric: 952,000 logic elements enable implementation of highly complex logic and parallel processing architectures.
• Substantial on-chip memory: Approximately 53 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• High I/O count: 696 I/Os support extensive connectivity options and system integration without excessive external multiplexing.
• Commercial-grade operating range: Rated for 0 °C to 85 °C to meet standard commercial deployment environments.
• Compact FCBGA package: 1517-BBGA (45 × 45 mm supplier package) provides a high-density package suitable for compact PCBs and surface-mount assembly.
• Regulatory compliance: RoHS-compliant for environmental and manufacturing requirements.

Why Choose 5SGXMABK3H40C4G?

The 5SGXMABK3H40C4G combines a high logic-element count, significant embedded memory, and a large I/O complement in a compact FCBGA package, making it a strong choice for commercial designs that require dense programmable logic and broad system connectivity. As a Stratix V GX device, it is positioned for use where integration density and on-chip memory capacity are decisive factors.

This device is appropriate for engineering teams building complex digital systems that prioritize on-chip resource availability and compact board-level integration while operating within commercial temperature limits.

Request a quote or submit an RFQ to obtain pricing and availability for the 5SGXMABK3H40C4G.