5SGXMABK3H40C3G

The 5SGXMABK3H40C3G is a Stratix V GX family FPGA from Intel, provided as a high-density, commercial-grade, surface-mount FCBGA device. It combines a large programmable logic fabric with substantial on-chip memory and a high I/O count for complex digital designs.

Engineered for demanding logic and interfacing tasks, this device is suited to designs that require extensive logic resources, significant embedded RAM, and broad I/O connectivity while operating within a commercial ambient temperature range.

Key Features

• Logic Capacity — Approximately 952,000 logic elements, enabling implementation of large-scale, custom digital designs and multi-module IP integration.
• Embedded Memory — Approximately 53 Mbits of on-chip RAM, supporting deep buffering, large FIFOs, and local data storage for high-throughput designs.
• I/O Density — 696 user I/O pins, accommodating high-port-count interfaces and complex board-level connectivity.
• Package & Mounting — 1517-BBGA, FCBGA package; supplier device package listed as 1517-HBGA (45x45). Surface-mount mounting type for compact board integration.
• Power/Voltage — Core supply specified from 820 mV to 880 mV, allowing designers to target the device’s required core voltage window precisely.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant for environmental and regulatory considerations.
• Series Documentation — Part of the Stratix V GX family; series-level datasheet covers electrical and switching characteristics, I/O timing, and transceiver speed-grade information.

Typical Applications

• High-density digital signal processing — Large logic capacity and substantial on-chip RAM make the device suitable for DSP pipelines, custom accelerators, and streaming data processing.
• Complex interface aggregation — High I/O count supports boards that require many parallel interfaces, bus bridging, or multi-channel sensor and control connectivity.
• Custom protocol and packet processing — The combination of logic resources and embedded memory supports implementation of packet engines, protocol offloads, and buffering.
• Commercial embedded systems — Commercial temperature grade and surface-mount FCBGA package fit a range of commercial electronics and compute applications operating within 0 °C to 85 °C.

Unique Advantages

• Extensive logic resource: Approximately 952,000 logic elements provide headroom for large designs and multiple instantiated IP blocks.
• Significant on-chip memory: ~53 Mbits of embedded RAM reduces dependence on external memory for many buffering and workspace needs.
• High I/O integration: 696 I/Os simplify board routing for multi-interface systems and minimize the need for external multipliers or expanders.
• Compact, production-ready package: 1517-BBGA (FCBGA) mounting supports dense board layouts while maintaining manufacturability with surface-mount assembly.
• Controlled core-voltage window: 820 mV–880 mV supply specification helps ensure predictable core power design and thermal planning.
• RoHS compliant: Facilitates integration into environmentally compliant commercial products.

Why Choose 5SGXMABK3H40C3G?

The 5SGXMABK3H40C3G delivers a balanced combination of high logic density, large embedded memory, and a high number of I/Os in a production-friendly FCBGA package. Its commercial-grade operating range and RoHS compliance make it suitable for a broad set of commercial embedded applications that require substantial on-chip resources and integration.

As a member of the Stratix V GX family from Intel, this device is supported by series-level documentation covering electrical characteristics and device-level guidance, helping teams plan power, timing, and I/O implementation for complex FPGA-based systems.

If you require pricing, availability, or a formal quote for 5SGXMABK3H40C3G, submit a product inquiry or request a quote through your preferred procurement channel.