5SGXMABK3H40C2N

The 5SGXMABK3H40C2N is a Stratix V GX family FPGA offered in a high-density 1517-BBGA (FCBGA) package. It delivers substantial programmable logic capacity, abundant embedded memory, and a large I/O count targeted at complex digital designs.

Key on-chip resources include 952,000 logic elements, approximately 53.25 Mbits of embedded memory, and up to 696 I/O pins. The device is a commercial-grade, surface-mount FPGA with a core supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• High Logic Capacity — 952,000 logic elements to implement large, complex digital designs and custom hardware acceleration.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for buffering, lookup tables, and state storage within the FPGA fabric.
• Extensive I/O — Up to 696 I/O pins to support wide parallel interfaces, multiple peripherals, and board-level connectivity.
• Package and Mounting — 1517-BBGA, FCBGA package; supplier package listed as 1517-HBGA (45×45 mm) and designed for surface-mount assembly.
• Power and Operating Range — Core supply specified from 870 mV to 930 mV; commercial operating temperature range from 0 °C to 85 °C.
• Compliance — RoHS compliant for environmental and regulatory alignment.
• Stratix V GX Family — Part of the Stratix V device family; refer to the Stratix V device datasheet for series-level electrical characteristics and transceiver speed grade information.

Typical Applications

• Large-scale digital systems — Designs that require hundreds of thousands of logic elements for custom compute and control functions.
• Memory-intensive processing — Systems that need significant on-chip RAM (approximately 53.25 Mbits) for buffering, packet storage, or LUT-based implementations.
• I/O-heavy boards — Applications requiring broad external connectivity with up to 696 I/Os for parallel busses, multi-channel interfaces, and board-level integration.
• Compact, high-density PCB designs — Surface-mount 1517-BBGA (45×45 mm) package for integration on space-constrained, high-density boards.

Unique Advantages

• Large programmable fabric: 952,000 logic elements enable implementation of complex custom logic without partitioning across multiple devices.
• Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory for many designs.
• High I/O count: 696 I/Os simplify system-level connectivity and reduce the need for external multiplexing or expanders.
• Commercial operating range: Rated for 0 °C to 85 °C, matching many standard embedded and enterprise environments.
• Surface-mount BBGA footprint: 1517-BBGA / 1517-HBGA (45×45 mm) package supports compact board layouts and automated assembly.
• Regulatory alignment: RoHS compliance supports environmental and sourcing requirements.

Why Choose 5SGXMABK3H40C2N?

The 5SGXMABK3H40C2N combines a very large logic fabric with substantial embedded memory and a high I/O count in a single commercial-grade surface-mount package. These characteristics make it well suited for developers building dense digital systems that require on-chip resources and extensive board connectivity without adding external devices.

Designed as part of the Stratix V GX family, this device offers series-level electrical and switching characteristics documented in the Stratix V datasheet, enabling engineers to evaluate transceiver and performance options at the family level while relying on the part’s explicit specifications for logic, memory, I/O, power, and package.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for the 5SGXMABK3H40C2N. Our team can assist with technical and procurement questions to help integrate this device into your design.