5SGXMABK2H40I3N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 952000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 935 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 359200 | Number of Logic Elements/Cells | 952000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMABK2H40I3N – Stratix® V GX Field Programmable Gate Array (FPGA), 952,000 logic elements
The 5SGXMABK2H40I3N is a Stratix V GX Field Programmable Gate Array from Intel designed for high-density, configurable logic applications. As a member of the Stratix V GX family, this device offers a large logic fabric, substantial embedded RAM, and an extensive I/O count for complex system integration in industrial environments.
Key value propositions include very high core density, significant on-chip memory capacity, wide I/O availability, and industrial temperature operation, enabling deployment in demanding embedded and system-level designs.
Key Features
- Core Density 952,000 logic elements to implement large-scale custom logic and complex finite-state machines.
- Embedded Memory Approximately 53.25 Mbits of embedded memory for buffering, packet processing, and data-path storage.
- I/O Resources 696 I/O pins to support wide external connectivity and multi-channel interfaces.
- Package 1517-BBGA FCBGA package (supplier package: 1517-HBGA, 45×45) suitable for high-pin-count board designs.
- Power Supply Core voltage supply range 820 mV to 880 mV for the device core rails.
- Industrial Temperature Grade Rated for operation from −40°C to 100°C for industrial applications.
- Mounting Surface mount device for standard PCB assembly processes.
- Environmental Compliance RoHS compliant.
- Family-Level Transceiver and Speed Grades The Stratix V family datasheet documents GX transceiver and core speed grades; family tables include GX transceiver speed examples specified in the device datasheet.
Typical Applications
- High-density custom logic Implement large programmable datapaths, complex state machines, and control logic where high logic element counts and on-chip RAM are required.
- Multi-channel I/O systems Support designs that need hundreds of I/O signals for interfacing with parallel buses, mezzanine cards, or dense front-panel connectors.
- Industrial embedded systems Deploy in temperature-challenging environments that require industrial-grade operation between −40°C and 100°C.
Unique Advantages
- Very high logic capacity: 952,000 logic elements enable consolidation of large functions into a single device, reducing board-level complexity.
- Substantial on-chip RAM: Approximately 53.25 Mbits of embedded memory simplifies buffering and local data storage without external memory.
- Extensive I/O count: 696 I/Os provide flexibility for broad system interfacing and parallel connectivity options.
- Industrial-grade operation: Specified operation from −40°C to 100°C supports deployment in a wide range of industrial environments.
- Compact high-pin package: 1517-BBGA FCBGA (1517-HBGA supplier package) delivers high I/O density in a single 45×45 package footprint.
- RoHS compliant: Meets common environmental compliance requirements for regulated markets.
Why Choose 5SGXMABK2H40I3N?
The 5SGXMABK2H40I3N positions itself as a high-capacity, industrial-grade FPGA option within the Stratix V GX family, offering designers a platform with nearly one million logic elements, tens of megabits of embedded RAM, and a large I/O complement. This combination supports consolidation of complex subsystems, reduces external component count, and simplifies board-level integration.
Ideal for engineering teams tackling large-scale programmable logic, dense I/O requirements, and temperature-challenging deployments, this device leverages the Stratix V family’s documented speed-grade and transceiver options and is supported by detailed electrical and switching characteristics in the family datasheet.
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