5SGXMABK2H40I3LG

The 5SGXMABK2H40I3LG is a Stratix V GX FPGA IC from Intel, offered in an industrial temperature grade and supplied in a 1517-BBGA (FCBGA) package. It delivers extremely high logic density and abundant I/O for demanding programmable-logic designs.

Designed for applications that require large on-chip memory, significant logic capacity, and a high I/O count, this device provides a combination of integration and robustness, with documented operating conditions and electrical characteristics available in the Stratix V device datasheet.

Key Features

• Core Logic Capacity  Approximately 952,000 logic elements to implement large, complex FPGA designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for data buffering, FIFOs, and memory-intensive logic functions.
• High I/O Count  696 user I/O pins to support dense board-level connectivity and multiple external interfaces.
• Power and Voltage  Core voltage supply specified from 0.820 V to 0.880 V for defined core operating conditions.
• Package and Mounting  1517-BBGA (FCBGA) package with supplier device package listed as 1517-HBGA (45×45); surface-mount mounting type.
• Industrial Temperature Range  Rated for operation from –40 °C to 100 °C, supporting industrial-environment deployments.
• Compliance  RoHS-compliant construction for regulatory and manufacturing requirements.

Typical Applications

• Industrial control and automation  Use where high logic density and a large number of I/Os are needed to interface sensors, actuators, and control networks within industrial systems.
• Embedded processing and system integration  Implement custom hardware accelerators and complex state machines that benefit from substantial on-chip RAM and logic resources.
• High‑channel I/O systems  Ideal for designs requiring many parallel I/Os for data acquisition, aggregation, or protocol bridging in harsh environments.

Unique Advantages

• High-density programmable logic: The large logic element count enables consolidation of multiple functions into a single FPGA, reducing BOM and board complexity.
• Significant embedded memory: Approximately 53.25 Mbits of on-chip RAM supports buffering and data-path acceleration without external memory dependence.
• Extensive I/O capability: 696 I/O pins allow flexible interfacing to a wide range of peripherals and high-channel-count systems.
• Industrial-grade thermal range: –40 °C to 100 °C rating supports deployment in temperature-challenging applications.
• Compact, board-ready package: 1517-BBGA (FCBGA) in a 45×45 supplier package provides a compact footprint for high-density PCBs.
• Defined core supply window: 0.820–0.880 V specification enables predictable power-architecture planning.

Why Choose 5SGXMABK2H40I3LG?

The 5SGXMABK2H40I3LG positions itself as a high-capacity Stratix V GX FPGA option for industrial designs that demand substantial programmable logic, on-chip memory, and broad I/O resources in a compact FCBGA package. Its industrial temperature rating and RoHS-compliant construction make it suitable for robust systems where environmental tolerance and regulatory compliance matter.

Backed by Stratix V device documentation from Intel, this device is appropriate for engineering teams building complex digital logic, embedded accelerators, and high-channel-count interfaces who require clear electrical and operating specifications to support system design and qualification.

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