5SGXMABK2H40I2LN

The 5SGXMABK2H40I2LN is a Stratix V GX family FPGA delivered in a 1517-BBGA FCBGA package. It combines a very large logic fabric with a high I/O count and industrial temperature grading for demanding embedded designs.

With 952,000 logic elements and approximately 53.25 Mbits of embedded memory, this device targets systems that require large on-chip logic capacity, significant on-chip RAM, and up to 696 user I/O pins, all in a surface-mount, RoHS-compliant package.

Key Features

• Core Logic  952,000 logic elements provide extensive programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 53.25 Mbits of total on-chip RAM to implement large buffers, FIFOs, and memory-intensive functions.
• I/O Capacity  696 user I/O pins to support wide parallel buses and numerous interface connections.
• Package & Mounting  1517-BBGA, FCBGA package (supplier package: 1517-HBGA, 45 × 45 mm) with surface-mount mounting for compact board-level integration.
• Power  Core voltage supply range of 820 mV to 880 mV for the device core domain.
• Industrial Temperature Grade  Rated operating temperature from −40°C to 100°C for deployment in industrial environments.
• Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• High-density digital systems  Use the large logic element count and substantial on-chip memory to implement complex signal processing, control logic, and compute-heavy functions on a single device.
• High-pin-count interfaces  Leverage up to 696 I/O pins for multi-lane parallel interfaces, expansion headers, or dense peripheral connectivity.
• Industrial embedded control  The industrial temperature rating (−40°C to 100°C) and surface-mount FCBGA package support deployment in rugged embedded and industrial control applications.

Unique Advantages

• Massive on-chip resources: 952,000 logic elements and ~53.25 Mbits of embedded RAM reduce the need for external logic and memory components.
• High I/O density: 696 I/O pins enable broad connectivity options and simplify board-level interfacing for complex systems.
• Industrial readiness: Rated for −40°C to 100°C operation, suitable for temperature-demanding installations.
• Compact, manufacturable package: 1517-BBGA FCBGA (1517-HBGA supplier package, 45 × 45 mm) with surface-mount assembly supports high-density PCB designs.
• Regulatory compliance: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose 5SGXMABK2H40I2LN?

The 5SGXMABK2H40I2LN delivers an FPGA platform with exceptional logic density, substantial embedded memory, and a high I/O count in an industrial-grade package. These characteristics make it well suited for engineers designing complex, space-constrained systems that demand significant on-chip compute and memory resources.

Its combination of core voltage specification, surface-mount FCBGA packaging, and RoHS compliance provides a clearly defined hardware profile for procurement and integration into long-life industrial designs. The device is positioned for projects where scalability of logic and memory resources, robust I/O capability, and industrial temperature operation are key selection criteria.

Request a quote or submit a pricing inquiry to get availability and lead-time information for the 5SGXMABK2H40I2LN.