5SGXMABK2H40I3LN

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 952000 1517-BBGA, FCBGA

Quantity 196 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359200Number of Logic Elements/Cells952000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMABK2H40I3LN – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXMABK2H40I3LN is an Intel Stratix V GX FPGA supplied in a 1517-BBGA (FCBGA) package. It provides a high-density programmable fabric with 952,000 logic elements and approximately 53.25 Mbits of embedded memory for complex digital designs.

Targeted at industrial applications, this surface-mount device offers 696 user I/Os, an industrial operating range (–40 °C to 100 °C), and a core voltage supply range of 820 mV to 880 mV, making it suitable for designs requiring extensive logic, on‑chip RAM and wide I/O capability.

Key Features

  • High Logic Density  952,000 logic elements (cells) provide substantial programmable resources for implementing large-scale digital functions and datapaths.
  • Embedded Memory  Approximately 53.25 Mbits of on-chip RAM supports large buffers, FIFOs and on‑chip storage for high-throughput designs.
  • I/O Capacity  Up to 696 user I/Os enable extensive external interfacing without external GPIO expanders.
  • Transceiver Capability (series-level)  Stratix V GX devices within the family include GX transceiver speed grades; series documentation lists GX channel speeds up to 14.1 Gbps for supported speed grades.
  • Package & Mounting  1517-BBGA (FCBGA) supplier device package 1517-HBGA (45×45) in a surface-mount format for high-density board designs.
  • Industrial Temperature Grade  Rated for –40 °C to 100 °C operation for deployment in industrial environments.
  • Low-Voltage Core Supply  Designed for a core voltage supply between 820 mV and 880 mV, consistent with high-performance FPGA core requirements.
  • Regulatory  RoHS compliant.

Typical Applications

  • High‑performance networking  Leverage the device’s high logic count, large on‑chip RAM and GX transceiver family capability for packet processing, traffic management and protocol offload engines.
  • Signal processing and acceleration  Extensive logic resources and embedded memory enable implementation of DSP pipelines, accelerators and custom compute blocks.
  • Industrial control and automation  Industrial temperature rating and abundant I/Os support robust motor control, machine-vision pre‑processing and I/O-intensive control systems.
  • Prototyping and system integration  Large logic capacity and high I/O count allow complex system prototypes and consolidation of multiple functions onto a single FPGA.

Unique Advantages

  • Massive programmable fabric: 952,000 logic elements provide headroom for large designs and feature integration on a single device.
  • Substantial on‑chip memory: Approximately 53.25 Mbits of embedded RAM reduces reliance on external memory for many buffering and state‑storage needs.
  • Extensive external connectivity: 696 I/Os simplify board-level integration for multi-interface systems and reduce peripheral complexity.
  • Industrial temperature operation: Rated –40 °C to 100 °C for deployment in industrial environments requiring extended temperature tolerance.
  • Surface-mount, high-density package: 1517-BBGA (45×45 supply package) enables dense PCB layouts for space-constrained systems.
  • Compliance-ready: RoHS compliant to support environmental and regulatory requirements.

Why Choose 5SGXMABK2H40I3LN?

The 5SGXMABK2H40I3LN delivers a compelling combination of high logic density, significant embedded memory and broad I/O capability within an industrial-temperature, surface-mount package. It is well suited to engineers and system designers who need to consolidate complex digital functions, large buffers and extensive external interfacing into a single Stratix V GX FPGA.

Backed by Intel’s Stratix V family documentation and industrial-grade specifications, this device supports demanding applications where on‑chip resources, I/O count and temperature range are key selection criteria.

Request a quote or submit an inquiry to obtain pricing and availability for 5SGXMABK2H40I3LN.

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