5SGXMABK3H40C2LN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 952000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 48 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 359200 | Number of Logic Elements/Cells | 952000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMABK3H40C2LN – Stratix V GX FPGA, 952000 logic elements, 696 I/Os
The 5SGXMABK3H40C2LN is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA package, offered as a commercial-grade device. It provides a high-density logic fabric with extensive on-chip memory and large I/O capacity for complex, high-integration designs. This device is suitable for applications that require a combination of logic capacity, embedded memory, and many I/O connections within a compact surface-mount package.
Key Features
- Logic Capacity Approximately 952,000 logic elements to implement large-scale digital designs and custom hardware functions.
- Embedded Memory Approximately 53.25 Mbits of on-chip RAM for data buffering, state storage, and algorithm implementation.
- I/O Density 696 user I/O pins to support wide parallel interfaces and multiple external peripherals.
- Power and Core Voltage Core supply operating range 820 mV to 880 mV to match low-voltage power-rail architectures.
- Package & Mounting 1517-BBGA (FCBGA) package, supplier device package 1517-HBGA (45×45); surface-mount mounting for high-pin-count PCB integration.
- Temperature Grade Commercial operating range: 0 °C to 85 °C for standard commercial-environment deployments.
- Standards Compliance RoHS compliant, supporting lead-free manufacturing processes.
- Stratix V Series Characteristics Electrical and switching characteristics are defined in the Stratix V device datasheet, which details operating conditions, power consumption, and I/O timing for Stratix V GX devices.
Typical Applications
- High-speed serial communication designs Leverage the Stratix V GX family characteristics to implement transceiver-based interfaces and high-throughput links.
- Custom compute and signal processing Use the large logic element count and ~53.25 Mbits of embedded RAM to implement complex algorithms and pipeline architectures.
- High-density I/O systems Support multi-channel parallel interfaces, bridging functions, and extensive sensor/actuator connectivity with 696 I/Os.
Unique Advantages
- High logic density: The ~952k logic elements enable integration of substantial custom logic and multiple IP blocks on a single device, reducing board-level complexity.
- Significant embedded memory: Approximately 53.25 Mbits of on-chip RAM supports buffering, lookup tables, and state machines without external memory dependence.
- Extensive I/O count: 696 I/Os accommodate large parallel buses and numerous peripherals, simplifying system partitioning.
- Compact high-pin-count package: The 1517-BBGA FCBGA package provides the necessary pin density for complex systems while remaining surface-mount compatible.
- Commercial temperature suitability: Rated 0 °C to 85 °C for mainstream electronic applications and environments.
- RoHS compliant: Meets lead-free manufacturing requirements for environmentally mindful production.
Why Choose 5SGXMABK3H40C2LN?
The 5SGXMABK3H40C2LN delivers a balance of high logic capacity, substantial embedded memory, and broad I/O connectivity in a single commercial-grade Stratix V GX FPGA. Its low core-voltage range and FCBGA package make it suitable for compact, high-density board designs where integration and on-chip resources reduce system bill-of-materials and simplify PCB routing.
This device is well suited to engineers and system designers building complex digital processing, high-throughput interfacing, or multi-channel I/O systems who require the documented electrical and switching characteristics provided for Stratix V GX devices.
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