5SGXMABK3H40C2LG

The 5SGXMABK3H40C2LG is a Stratix® V GX Field Programmable Gate Array (FPGA) designed for high-density logic integration and complex system-level implementations. This commercial-grade device delivers 952,000 logic elements and substantial on-chip memory to support large designs requiring extensive programmable logic and buffering.

With 696 I/O pins, a compact 1517-BBGA FCBGA package (supplier package: 1517-HBGA, 45×45), and a low-voltage core supply range, the part is intended for designs that need high integration density, high I/O count, and controlled power domains.

Key Features

• High Logic Density — 952,000 logic elements to implement complex digital functions and large-scale gate arrays.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• Rich I/O Count — 696 available I/O pins to support high-pin-count interfaces and dense board-level connectivity.
• Package & Mounting — 1517-BBGA (FCBGA) package with supplier package 1517-HBGA (45×45); surface-mountable for modern PCBA assembly flows.
• Power — Core voltage supply specified from 820 mV to 880 mV to match low-voltage system power architectures.
• Operating Temperature — Commercial temperature range of 0°C to 85°C for standard electronics environments.
• Compliance — RoHS compliant.

Typical Applications

• High-density digital systems — Implement large-scale programmable logic, custom accelerators, and complex state machines using the device's extensive logic element count and embedded memory.
• Data buffering and packet processing — On-chip RAM capacity supports buffering, packet queues, and local data manipulation in high-throughput designs.
• Multi-I/O system integration — The 696 I/Os enable integration with numerous external devices, high-pin-count connectors, and complex board-level interfaces.

Unique Advantages

• Substantial programmable resources — 952,000 logic elements provide headroom for feature-rich FPGA implementations without immediate need for external logic.
• Large embedded memory — Approximately 53.25 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage tasks, simplifying system design.
• High I/O density — 696 I/Os allow comprehensive connectivity for mixed-signal front-ends, high-speed interfaces, and multi-channel systems.
• Compact BGA package — 1517-BBGA / 1517-HBGA (45×45) balances high pin-count with a compact footprint for space-constrained PCBs.
• Low-voltage core operation — Core supply range of 820 mV–880 mV aligns with modern low-voltage power domains to support efficient power architecture planning.
• RoHS compliant — Meets standard environmental compliance for lead-free assembly processes.

Why Choose 5SGXMABK3H40C2LG?

The 5SGXMABK3H40C2LG positions itself as a high-density, commercial-grade Stratix V GX FPGA that combines a large pool of logic elements, substantial embedded RAM, and a very high I/O count in a compact BGA package. It is suited for engineers and designers building complex digital systems that require extensive programmable resources and board-level connectivity while operating within standard commercial temperature ranges.

Choosing this part supports designs that need scalability within the Stratix V family, with attention to power budgeting enabled by its specified core voltage range and surface-mount BGA packaging suitable for modern assembly processes.

Request a quote or submit an inquiry to receive pricing, availability, and technical assistance for integrating the 5SGXMABK3H40C2LG into your next design.