5SGXMABK3H40C2G

The 5SGXMABK3H40C2G is an Intel Stratix® V GX field programmable gate array supplied in a 1517-BBGA FCBGA package. It delivers very high logic capacity, substantial on‑chip memory, and a large I/O count for demanding programmable logic designs.

This commercial-grade device is surface-mountable and operates from a core voltage range of 870 mV to 930 mV with an ambient operating temperature range of 0 °C to 85 °C, making it suitable for applications that require high integration density and significant I/O bandwidth.

Key Features

• Logic Capacity  Provides 952,000 logic elements for large, complex designs and extensive parallel processing implementations.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM to support large buffers, deep FIFOs, and memory-intensive algorithms.
• I/O Resources  696 user I/O pins to interface with high-channel-count peripherals, multi-lane transceivers, and complex board topologies.
• Package & Mounting  Supplied in a 1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45). Surface-mount mounting simplifies assembly on modern PCBs.
• Power  Core voltage supply range of 870 mV–930 mV for the device core power domain.
• Operating Grade & Temperature  Commercial temperature grade with an operating range of 0 °C–85 °C.
• Regulatory  RoHS compliant for lead-free assembly and environmental compliance.

Typical Applications

• High-density logic implementations  Ideal for designs that require hundreds of thousands of logic elements and extensive on-chip memory.
• High‑I/O and multi-channel interfaces  Large I/O count supports board-level systems with many external interfaces or multi-lane connectivity.
• Memory‑intensive processing  Approximately 53 Mbits of embedded RAM supports buffering, packet processing, and algorithm acceleration within the FPGA fabric.

Unique Advantages

• Massive programmable capacity: 952,000 logic elements enable consolidation of multiple functions into a single device, reducing system BOM and board area.
• Substantial on-chip RAM: Approximately 53 Mbits of embedded memory supports larger datasets on-chip and reduces reliance on external memory.
• Extensive I/O availability: 696 I/O pins accommodate complex interfacing needs without additional multiplexing hardware.
• Compact BGA packaging: 1517-BBGA/1517-HBGA (45×45) package provides a high-pin-count solution in a compact footprint for dense PCB layouts.
• Commercial operating range: Rated for 0 °C–85 °C, suitable for a wide range of commercial applications and environments.
• RoHS compliant: Supports lead‑free manufacturing and environmental requirements.

Why Choose 5SGXMABK3H40C2G?

The 5SGXMABK3H40C2G positions itself as a high-capacity Stratix V GX FPGA for designs that demand extensive programmable logic, substantial embedded memory, and a high number of I/Os. Its combination of 952,000 logic elements, approximately 53 Mbits of on-chip RAM, and 696 I/O pins makes it well suited to consolidate complex digital systems into a single FPGA footprint.

Engineers and system designers targeting commercial applications will find this device appropriate where integration density, on‑chip buffering, and broad interfacing are priorities. The device’s package options and surface-mount format support modern PCB assembly while the RoHS compliance aligns with common manufacturing requirements.

Request a quote or submit a request for pricing and availability for the 5SGXMABK3H40C2G to begin specifying this Stratix® V GX FPGA into your next design.