5SGXMABK2H40I3G

The 5SGXMABK2H40I3G is a Stratix V GX Field Programmable Gate Array (FPGA) IC offering very high logic capacity and on-chip memory in an industrial-grade surface-mount FCBGA package. It provides 952,000 logic elements and approximately 53 Mbits of embedded RAM, together with 696 I/O pins, making it suitable for high-density programmable logic and transceiver-enabled Stratix V GX system designs.

This device operates with a core voltage range of 820 mV to 880 mV and is rated for an operating temperature range of –40 °C to 100 °C. The package is a 1517-BBGA (supplier device package listed as 1517-HBGA, 45×45), and the device is RoHS compliant.

Key Features

• Core Capacity — 952,000 logic elements (logic cells) to support large, complex FPGA designs.
• Embedded Memory — Approximately 53 Mbits of on-chip RAM for buffering, state storage, and data-path implementations.
• I/O Density — 696 programmable I/O pins to interface with high-pin-count systems and peripherals.
• Transceiver Capabilities — As part of the Stratix V GX family, the datasheet documents transceiver speed grades including 14.1 Gbps, 12.5 Gbps, and 8.5 Gbps (family-level specification).
• Power — Core supply voltage range: 820 mV to 880 mV for validated operating conditions.
• Package — 1517-BBGA, FCBGA package; supplier package noted as 1517-HBGA (45×45) for compact, high-ball-count mounting.
• Temperature & Grade — Industrial grade with an operating range of –40 °C to 100 °C.
• Mounting & Compliance — Surface-mount device; RoHS compliant.

Typical Applications

• High-density programmable logic systems — Integrate large amounts of logic and embedded RAM into a single FPGA for consolidation of complex logic functions.
• High-throughput data paths — Leverage the family’s transceiver speed-grade options for designs that require high-speed serial interfaces (family-level capability noted in the datasheet).
• Industrial control and processing — Industrial temperature rating and extensive I/O enable deployment in rugged embedded systems.
• Memory-intensive processing — Approximately 53 Mbits of on-chip RAM supports buffering, packet handling, and stateful data processing within the FPGA.

Unique Advantages

• High logic density: 952,000 logic elements provide capacity for complex designs and system consolidation into a single FPGA.
• Substantial on-chip memory: Approximately 53 Mbits of embedded RAM supports large internal buffers and data-path storage without immediate external memory dependency.
• Extensive I/O count: 696 I/Os enable broad interfacing options for peripheral connectivity and board-level integration.
• Industrial operating range: Rated from –40 °C to 100 °C for use in temperature-demanding environments.
• Compact, high-ball-count package: 1517-BBGA (supplier: 1517-HBGA, 45×45) provides a dense, surface-mount footprint for space-constrained designs.
• Standards-aligned supply and compliance: Core voltage range defined at 820 mV–880 mV and RoHS compliance for regulatory alignment.

Why Choose 5SGXMABK2H40I3G?

The 5SGXMABK2H40I3G positions itself as a high-capacity Stratix V GX FPGA option for designs that demand large programmable logic, significant on-chip memory, and abundant I/O in an industrial-temperature, surface-mount package. Its combination of 952,000 logic elements, roughly 53 Mbits of embedded RAM, and 696 I/Os supports consolidation of complex functions and memory-rich processing within a single device.

Designed for developers and procurement teams working on high-density, industrial-grade FPGA applications, this device delivers measurable capacity and clearly defined electrical and thermal operating ranges as recorded in the product data and family datasheet.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGXMABK2H40I3G. Technical documentation and the Stratix V device datasheet are available to support your evaluation and design planning.