5SGXMABK3H40C3NCV

The 5SGXMABK3H40C3NCV is a Stratix V GX field-programmable gate array (FPGA) from Intel, offered in a 1517-BBGA FCBGA package (supplier package: 1517-HBGA, 45×45). It delivers a very large logic capacity and extensive I/O to support complex, I/O‑rich digital designs.

With approximately 952,000 logic elements, about 53 Mbits of embedded memory, and 696 user I/Os, this commercial‑grade device is suited for designs that require high integration of logic, memory, and I/O in a single device while operating within a commercial temperature range and low core-voltage domain.

Key Features

• Core Logic  Approximately 952,000 logic elements provide substantial on-chip programmable logic resources for large designs and complex processing functions.
• Logic Block Count  359,200 reported LABs/CLBs count (device-level block count provided in product data) for mapping and resource planning.
• Embedded Memory  Approximately 53 Mbits of total on-chip RAM bits to support buffers, FIFOs, and local data storage without external memory.
• I/O Density  696 user I/Os to support wide parallel interfaces, multi-protocol I/O arrays, and high pin-count system integration.
• Power and Core Voltage  Specified core supply range of 820 mV to 880 mV for designs targeting low-voltage core operation.
• Package and Assembly  1517-BBGA FCBGA package (supplier listed as 1517-HBGA, 45×45) with surface-mount mounting type for compact, high-pin-count board layouts.
• Grade and Temperature Range  Commercial grade device with an operating temperature range of 0 °C to 85 °C suitable for standard commercial environments.
• Regulatory Compliance  RoHS compliant per product data.

Typical Applications

• High-density digital processing  Use the large logic capacity and embedded RAM for complex data-paths, packet processing, and algorithm acceleration.
• Networking and telecom systems  Leverage abundant I/O and on-chip memory for multi-lane interfaces, protocol bridging, and line-card integrations.
• Test and measurement equipment  Implement programmable data acquisition, signal conditioning, and real-time pre-processing inside a single FPGA.
• Compute and FPGA acceleration  Map compute kernels and buffering into the device’s large logic and memory resources for application-specific acceleration.

Unique Advantages

• Very large logic footprint: Approximately 952,000 logic elements enable consolidation of large subsystems into one device, reducing board-level complexity.
• Substantial on-chip memory: Around 53 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching use cases.
• High I/O count: 696 I/Os accommodate wide parallel interfaces and multiple peripheral connections without additional glue logic.
• Compact, high‑pin package: The 1517-BBGA (1517-HBGA supplier package) delivers high pin density in a surface-mount form factor for space-constrained designs.
• Commercial temperature and RoHS compliance: Clear commercial operating range (0 °C to 85 °C) and RoHS status simplify qualification for general-purpose products.

Why Choose 5SGXMABK3H40C3NCV?

This Stratix V GX FPGA combines very high logic density, significant embedded memory, and extensive I/O in a single commercial‑grade package, making it appropriate for large-scale, I/O‑intensive digital systems. It is well suited to designers who need to integrate multiple functions into one device to reduce board-level components and simplify system architecture.

As a member of the Stratix V family from Intel, the 5SGXMABK3H40C3NCV provides predictable device-level specifications—logic capacity, memory, I/O, package, core-voltage range, and operating temperature—so teams can plan integration and thermal/power budgets with the available data.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the 5SGXMABK3H40C3NCV.