5SGXMABK3H40I3LG

The 5SGXMABK3H40I3LG is a Stratix V GX field-programmable gate array (FPGA) IC intended for high-density logic and memory‑rich designs. This industrial‑grade device combines large logic capacity, abundant I/O, and substantial embedded RAM to address designs that require high integration and deterministic on-chip resources.

Built in a 1517‑BBGA (FCBGA) package and rated for extended temperature operation, the device is suitable for systems that require wide operating temperature range and a low core voltage domain.

Key Features

• Core Logic — 952,000 logic elements provide high integration for complex RTL and compute‑heavy implementations.
• Embedded Memory — Approximately 53.248 Mbits of on‑chip RAM support buffering, lookup tables, and memory‑intensive processing without external memory dependency.
• I/O Density — 696 user I/Os enable extensive external interfacing and multi‑channel connectivity for large systems.
• Package — 1517‑BBGA (FCBGA) supplier package specified as 1517‑HBGA (45 × 45) provides high pin count in a ball‑grid array footprint suited for dense PCB layouts.
• Power Supply — Core voltage supply range from 820 mV to 880 mV for the device core domain.
• Temperature Rating — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in wide‑temperature environments.
• Mounting — Surface‑mount device designed for standard PCB assembly processes.
• Standards Compliance — RoHS‑compliant material status.

Typical Applications

• High‑density logic systems — Implement large custom logic blocks, protocol engines, and complex state machines using the device’s 952,000 logic elements.
• Memory‑intensive processing — On‑chip RAM (≈53.248 Mbits) supports packet buffering, frame memory, and data staging without immediate external memory.
• Multi‑I/O aggregation — 696 I/Os enable aggregation and bridging of many peripherals, sensors, or data lanes in a single FPGA footprint.
• Wide‑temperature embedded systems — Industrial temperature rating (−40 °C to 100 °C) supports applications that require reliable operation across a broad thermal range.

Unique Advantages

• Large logic fabric — 952,000 logic elements reduce the need for multiple FPGAs, simplifying board design and lowering BOM complexity.
• Substantial on‑chip RAM — Approximately 53.248 Mbits of embedded memory enables local buffering and reduces external memory bandwidth needs.
• High I/O count — 696 I/Os provide flexibility for high‑channel count interfaces, consolidating connectivity onto one device.
• Industrial temperature operation — Rated from −40 °C to 100 °C for dependable performance in demanding thermal environments.
• Compact, high‑pin package — 1517‑BBGA (FCBGA) package supports high pin density for complex system integration while maintaining a manageable PCB footprint.
• Low core voltage domain — Specified 820 mV to 880 mV core supply enables designs optimized for the device’s power domain requirements.

Why Choose 5SGXMABK3H40I3LG?

This Stratix V GX FPGA delivers a compelling combination of high logic capacity, significant embedded RAM, and extensive I/O in a single industrial‑grade package. It is positioned for designs that require consolidated FPGA resources—reducing the need for additional devices—while supporting wide temperature operation and a low core voltage domain.

Engineers and system designers seeking a scalable, robust FPGA platform for large‑scale logic, memory‑centric processing, and high I/O integration will find the 5SGXMABK3H40I3LG appropriate for demanding embedded and industrial applications. Documentation and device electrical characteristics are provided in the Stratix V device datasheet for detailed system design and validation.

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