5SGXMB5R1F43C2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 41984000 490000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 850 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 41984000 |
Overview of 5SGXMB5R1F43C2N – Stratix® V GX Field Programmable Gate Array, 1760-FCBGA
The 5SGXMB5R1F43C2N is a Stratix V GX family Field Programmable Gate Array (FPGA) in a 1760-ball FCBGA package (42.5 × 42.5 mm) targeted at commercial applications. It delivers a high logic capacity and embedded memory footprint suitable for demanding digital designs that require dense programmable logic, abundant on-chip RAM, and extensive I/O.
Key capabilities include 490,000 logic elements, approximately 42 Mbits of embedded memory, and up to 600 I/O pins. The device operates from a core supply range of 870 mV to 930 mV and is specified for commercial temperature operation from 0 °C to 85 °C.
Key Features
- Core Logic Density 490,000 logic elements provide substantial programmable fabric for complex logic, state machines, and custom datapaths.
- Embedded Memory Approximately 42 Mbits of on-chip RAM to support large buffering, packet processing, and state storage without external memory.
- High I/O Count Up to 600 I/O pins allow dense connectivity to peripherals, transceivers, and board-level interfaces.
- Commercial Temperature Grade Specified for 0 °C to 85 °C operation, suitable for a wide range of commercial and industrial-adjacent applications where commercial grade is required.
- Power and Voltage Core supply range from 870 mV to 930 mV for compatibility with system power rails and voltage management strategies.
- Package and Mounting 1760-FCBGA (42.5 × 42.5 mm), surface-mount package for compact, high-density board designs.
- RoHS Compliant Manufactured to RoHS standards.
- Stratix V GX Family Characteristics As a Stratix V GX-class device, the family-level documentation includes GX transceiver capability and Stratix V device electrical characteristics.
Typical Applications
- High-density digital processing Implement large-scale custom logic, datapath engines, and parallel processing pipelines using the device's 490,000 logic elements and ample embedded RAM.
- Networking and packet processing Leverage the high I/O count and on-chip memory for building packet classification, buffering, and protocol offload functions.
- FPGA-based prototyping and hardware acceleration Use the device to prototype ASICs or accelerate compute kernels that require significant logic resources and memory close to the fabric.
- Signal processing and imaging Deploy large DSP chains and frame buffers using the embedded memory and abundant logic resources for real-time processing tasks.
Unique Advantages
- High logic capacity: 490,000 logic elements enable implementation of complex systems-on-chip and multi-function designs without immediate partitioning across multiple devices.
- Substantial on-chip RAM: Approximately 42 Mbits of embedded memory reduces dependence on external memory and simplifies board design for many buffering and storage needs.
- Extensive I/O: Up to 600 I/O pins give flexibility for wide buses, multiple interfaces, and high-pin-count connectivity.
- Commercial-grade specification: Rated for 0 °C to 85 °C operation to meet typical commercial application thermal requirements.
- Compact FCBGA packaging: 1760-ball FCBGA in a 42.5 × 42.5 mm footprint supports high-density layouts while keeping board area predictable.
- Standards-compliant manufacturing: RoHS compliance supports regulatory and environmental requirements.
Why Choose 5SGXMB5R1F43C2N?
The 5SGXMB5R1F43C2N positions itself as a high-capacity, commercially rated Stratix V GX FPGA tailored for designs that require large programmable logic, significant embedded memory, and broad I/O options within a single FCBGA package. Its combination of 490,000 logic elements, approximately 42 Mbits of on-chip RAM, and up to 600 I/O pins makes it suitable for engineers building complex digital systems, network processing functions, and FPGA-based accelerators.
Backed by Stratix V family documentation and designed for surface-mount integration, this device offers a scalable platform for projects that need robust logic capacity, integrated memory, and dense connectivity while adhering to commercial temperature and RoHS standards.
Request a quote or submit a sales inquiry to learn more about availability, packaging options, and ordering information for the 5SGXMB5R1F43C2N.

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