5SGXMB5R2F40C1G

The 5SGXMB5R2F40C1G is a Stratix V GX field-programmable gate array from Intel, supplied in a 1517-FBGA (40×40) package for surface-mount assembly. It provides a large logic fabric and extensive I/O for complex digital designs where high resource density and substantial embedded memory are required.

With 490,000 logic elements, 432 user I/O pins, and approximately 42 Mbits of on-chip RAM, this commercially graded device is aimed at applications that demand dense logic integration and significant on-chip storage within a commercial temperature range.

Key Features

• Logic Capacity — 490,000 logic elements to implement complex digital functions and large-scale state machines.
• Embedded Memory — Approximately 42 Mbits of total on-chip RAM for buffering, look-up tables, and higher-level data storage.
• I/O Resources — 432 user I/O pins, enabling wide parallel interfaces and high-density connectivity to peripherals and mezzanine modules.
• Package & Mounting — 1517-FBGA (40×40) supplier device package, designed for surface-mount PCB assembly and dense board layouts.
• Power/Fabric Voltage — Core supply voltage range from 870 mV to 930 mV, allowing designers to plan power delivery and decoupling for the FPGA core.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial-environment deployments.
• RoHS Compliance — Conforms to RoHS requirements for lead-free manufacturing and regulatory compliance.

Typical Applications

• Telecom and Networking — Implement packet-processing engines, protocol bridging, and interface aggregation using the device’s large logic capacity and abundant I/O.
• Data Processing & Acceleration — Deploy on-chip memory and logic resources for custom acceleration blocks, buffering, and real-time data manipulation.
• Video and Imaging Systems — Use the wide I/O and embedded RAM for image pipelines, frame buffering, and parallel video interfaces.
• Prototyping and System Integration — Integrate large custom logic blocks and multiple peripheral interfaces for board-level prototypes and complex system validation.

Unique Advantages

• High logic density: 490,000 logic elements provide the headroom needed for large-scale digital designs without immediate migration to multiple devices.
• Substantial on-chip RAM: Approximately 42 Mbits of embedded memory reduces external memory dependency for many buffering and lookup requirements.
• Extensive I/O count: 432 user I/Os enable multi-channel connectivity and wide parallel buses for throughput-intensive applications.
• Compact BGA package: The 1517-FBGA (40×40) footprint supports dense board layouts while remaining suitable for surface-mount assembly processes.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial deployments and environments.
• RoHS compliant: Supports lead-free manufacturing and downstream regulatory requirements.

Why Choose 5SGXMB5R2F40C1G?

The 5SGXMB5R2F40C1G delivers a balance of logic capacity, embedded memory, and I/O density in a single, surface-mount 1517-FBGA package, making it well suited for designers building complex digital systems within commercial temperature environments. Its core voltage range and RoHS compliance help teams plan power distribution and manufacturing flows with confidence.

This Intel Stratix V GX device is a fit for engineering teams needing significant on-chip resources for integration, prototyping, or production-level designs that leverage a large logic fabric and substantial embedded memory to reduce external component count and simplify board-level architecture.

Request a quote or submit a pricing inquiry to evaluate 5SGXMB5R2F40C1G for your next design and confirm availability and lead times.