5SGXMB5R1F43C2LN

The 5SGXMB5R1F43C2LN is a Stratix V GX field programmable gate array (FPGA) in a 1760-ball FCBGA/BBGA package. It delivers high logic density and substantial on-chip memory for complex digital designs, with a broad I/O count and support for Stratix V GX transceiver speed grades described in the device family datasheet.

Designed for commercial-grade applications, this device targets designs that require large programmable logic capacity, significant embedded RAM, and high-density connectivity within a 42.5 × 42.5 mm 1760-FCBGA package.

Key Features

• Logic Capacity — 490,000 logic elements to implement large-scale, highly parallel digital designs.
• Embedded Memory — Approximately 42 Mbits of on-chip RAM (41,984,000 bits) for buffers, FIFOs, and local data storage.
• I/O Density — 600 user I/Os to support dense peripheral, bus, and interface routing on complex PCBs.
• Transceiver Speed Grades (Stratix V GX family) — Stratix V GX devices include transceiver speed grades listed in the datasheet (examples include GX channel—14.1 Gbps and 12.5 Gbps), providing options for high-speed serial interfaces at the family level.
• Power and Voltage — Core supply operating range of 820 mV to 880 mV for core power planning and thermal design.
• Package — 1760-FCBGA / 1760-BBGA package, supplier device package specified as 1760-FCBGA (42.5 × 42.5 mm), suitable for high-density board layouts.
• Commercial Grade Temperature — Rated for operation from 0 °C to 85 °C, meeting commercial temperature requirements.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-speed serial interfaces — Use the Stratix V GX family transceiver speed grades to implement high-bandwidth serial links where supported by the device family.
• Compute- and signal-processing designs — Large logic element count and substantial embedded RAM support complex processing pipelines and parallel algorithms.
• Dense I/O systems — With 600 I/Os, integrate multiple peripherals, memory interfaces, or board-level buses in a single FPGA.
• Complex system integration — High logic capacity and package density enable consolidation of multiple functions into one programmable device for advanced commercial systems.

Unique Advantages

• High logic integration: 490,000 logic elements reduce the need for multiple devices by accommodating large designs in one FPGA.
• Significant on-chip memory: Approximately 42 Mbits of embedded RAM simplifies data buffering and on-chip storage for memory-intensive functions.
• Extensive I/O: 600 I/Os provide flexibility for routing multiple external interfaces without external multiplexing.
• Family-level transceiver options: Stratix V GX family transceiver speed grades (as documented in the datasheet) support a range of high-speed serial link requirements at the family level.
• Compact, high-density package: 1760-FCBGA (42.5 × 42.5 mm) enables high-density PCB designs while keeping the solution integrated.
• Commercial operating range: Rated 0 °C to 85 °C for deployment in commercial-grade systems.

Why Choose 5SGXMB5R1F43C2LN?

The 5SGXMB5R1F43C2LN combines substantial logic capacity, large on-chip memory, and a high I/O count in a single commercial-grade Stratix V GX FPGA package. It is well suited for designers who need to implement complex, high-density logic and memory architectures while retaining options for high-speed serial interfaces at the Stratix V GX family level.

For teams developing advanced commercial systems, this device offers a balance of performance, integration, and environmental compliance that supports scalable, long-lived designs backed by the Stratix V device family documentation.

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