A54SX72A-2FGG256
| Part Description |
SX-A Field Programmable Gate Array (FPGA) IC 203 256-BGA |
|---|---|
| Quantity | 206 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 203 | Voltage | 2.25 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6036 | Number of Logic Elements/Cells | 6036 | ||
| Number of Gates | 108000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A54SX72A-2FGG256 – SX-A FPGA, 203 I/O, 256-BGA
The A54SX72A-2FGG256 is a nonvolatile, single-chip SX-A family FPGA provided in a 256-pin fine-pitch BGA package. It delivers a balance of logic capacity and I/O density—providing approximately 108,000 system gates implemented across 6,036 logic elements with up to 203 user-programmable I/Os.
Designed for applications that require configurable I/O, deterministic timing and on-chip security, the device supports mixed-voltage operation and PCI-compatible interfaces while remaining a surface-mount, RoHS-compliant commercial-grade FPGA (0 °C to 70 °C). The -2 speed grade offers higher speed performance relative to the standard device.
Key Features
- Core capacity — Approximately 108,000 system gates implemented across 6,036 logic elements and up to 2,012 dedicated flip-flops for mid-range FPGA designs.
- Performance — Family-level system and internal performance characteristics include up to 250 MHz system performance and up to 350 MHz internal performance.
- I/O and interface support — Up to 203 user I/Os with configurable I/O support for 3.3 V / 5 V PCI, 5 V TTL, 3.3 V LVTTL and 2.5 V LVCMOS2 signaling; supports 2.5 V, 3.3 V and 5 V mixed-voltage operation with 5 V input tolerance and 5 V drive strength.
- Packaging and mounting — 256-pin fine-pitch FBGA (256-FPBGA, 17 × 17) in a surface-mount package for compact board-level integration.
- Power and reliability — Power-up/power-down friendly operation with no supply sequencing required and hot-swap compliant I/Os for adaptable system power handling.
- Standards and testability — 66 MHz PCI compliant and supports IEEE 1149.1 boundary-scan (JTAG) for board-level test and diagnostics.
- Security and in-system diagnostics — Nonvolatile configuration with Actel Secure Programming Technology (FuseLock™) to help protect design IP, plus in-system diagnostic and verification capability with Silicon Explorer II.
- Resource utilization and timing — Supports up to 100% resource utilization and 100% pin locking with deterministic, user-controllable timing for predictable system behavior.
- Commercial temperature and RoHS compliance — Rated for commercial operation (0 °C to 70 °C) and RoHS-compliant packaging.
Typical Applications
- PCI interface and bridging — Use the device’s 66 MHz PCI compliance and configurable 3.3 V/5 V PCI I/O support for interface logic and protocol bridging.
- Embedded system glue logic — High I/O count and mixed-voltage I/O capability make the part suitable for board-level glue logic, bus multiplexing and custom control functions.
- Security-sensitive designs — Nonvolatile configuration and FuseLock™ secure programming protect intellectual property and help prevent reverse engineering in deployed systems.
- In-system diagnostics and validation — Built-in boundary-scan and Silicon Explorer II support enable board-level test, verification and diagnostic workflows.
Unique Advantages
- Nonvolatile, single-chip configuration — Eliminates the need for external configuration memory, simplifying BOM and startup behavior.
- Mixed-voltage I/O — Native support for 2.5 V, 3.3 V and 5 V signaling reduces the need for level shifters when interfacing diverse subsystems.
- High I/O density — Up to 203 user I/Os in a 256-pin FBGA supports complex peripheral and bus connectivity in a compact footprint.
- Secure programming — FuseLock™ technology offers on-chip protection of configuration data to address IP protection requirements.
- Deterministic timing and full resource utilization — User-controllable timing and support for up to 100% resource utilization improve predictability for timing-sensitive designs.
- Board-level testability — IEEE 1149.1 JTAG and in-system diagnostic support simplify manufacturing test and field diagnostics.
Why Choose A54SX72A-2FGG256?
The A54SX72A-2FGG256 positions itself as a midsize, nonvolatile FPGA that combines substantial logic capacity with flexible, mixed-voltage I/O and integrated security features. Its combination of approximately 108,000 system gates, 6,036 logic elements and up to 203 user I/Os makes it suitable for designs that need a balance of logic resources and dense board-level connectivity without external configuration memory.
Choose this device for applications that require predictable timing control, on-board IP protection, PCI-compatible interfaces and robust testability in a compact 256-FBGA package. Its commercial-grade temperature rating and RoHS-compliant packaging align it with mainstream embedded and electronic system designs requiring proven, field-deployable FPGA functionality.
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