A54SX72A-2FGG256

IC FPGA 203 I/O 256FBGA
Part Description

SX-A Field Programmable Gate Array (FPGA) IC 203 256-BGA

Quantity 206 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-BGANumber of I/O203Voltage2.25 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6036Number of Logic Elements/Cells6036
Number of Gates108000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A54SX72A-2FGG256 – SX-A FPGA, 203 I/O, 256-BGA

The A54SX72A-2FGG256 is a nonvolatile, single-chip SX-A family FPGA provided in a 256-pin fine-pitch BGA package. It delivers a balance of logic capacity and I/O density—providing approximately 108,000 system gates implemented across 6,036 logic elements with up to 203 user-programmable I/Os.

Designed for applications that require configurable I/O, deterministic timing and on-chip security, the device supports mixed-voltage operation and PCI-compatible interfaces while remaining a surface-mount, RoHS-compliant commercial-grade FPGA (0 °C to 70 °C). The -2 speed grade offers higher speed performance relative to the standard device.

Key Features

  • Core capacity — Approximately 108,000 system gates implemented across 6,036 logic elements and up to 2,012 dedicated flip-flops for mid-range FPGA designs.
  • Performance — Family-level system and internal performance characteristics include up to 250 MHz system performance and up to 350 MHz internal performance.
  • I/O and interface support — Up to 203 user I/Os with configurable I/O support for 3.3 V / 5 V PCI, 5 V TTL, 3.3 V LVTTL and 2.5 V LVCMOS2 signaling; supports 2.5 V, 3.3 V and 5 V mixed-voltage operation with 5 V input tolerance and 5 V drive strength.
  • Packaging and mounting — 256-pin fine-pitch FBGA (256-FPBGA, 17 × 17) in a surface-mount package for compact board-level integration.
  • Power and reliability — Power-up/power-down friendly operation with no supply sequencing required and hot-swap compliant I/Os for adaptable system power handling.
  • Standards and testability — 66 MHz PCI compliant and supports IEEE 1149.1 boundary-scan (JTAG) for board-level test and diagnostics.
  • Security and in-system diagnostics — Nonvolatile configuration with Actel Secure Programming Technology (FuseLock™) to help protect design IP, plus in-system diagnostic and verification capability with Silicon Explorer II.
  • Resource utilization and timing — Supports up to 100% resource utilization and 100% pin locking with deterministic, user-controllable timing for predictable system behavior.
  • Commercial temperature and RoHS compliance — Rated for commercial operation (0 °C to 70 °C) and RoHS-compliant packaging.

Typical Applications

  • PCI interface and bridging — Use the device’s 66 MHz PCI compliance and configurable 3.3 V/5 V PCI I/O support for interface logic and protocol bridging.
  • Embedded system glue logic — High I/O count and mixed-voltage I/O capability make the part suitable for board-level glue logic, bus multiplexing and custom control functions.
  • Security-sensitive designs — Nonvolatile configuration and FuseLock™ secure programming protect intellectual property and help prevent reverse engineering in deployed systems.
  • In-system diagnostics and validation — Built-in boundary-scan and Silicon Explorer II support enable board-level test, verification and diagnostic workflows.

Unique Advantages

  • Nonvolatile, single-chip configuration — Eliminates the need for external configuration memory, simplifying BOM and startup behavior.
  • Mixed-voltage I/O — Native support for 2.5 V, 3.3 V and 5 V signaling reduces the need for level shifters when interfacing diverse subsystems.
  • High I/O density — Up to 203 user I/Os in a 256-pin FBGA supports complex peripheral and bus connectivity in a compact footprint.
  • Secure programming — FuseLock™ technology offers on-chip protection of configuration data to address IP protection requirements.
  • Deterministic timing and full resource utilization — User-controllable timing and support for up to 100% resource utilization improve predictability for timing-sensitive designs.
  • Board-level testability — IEEE 1149.1 JTAG and in-system diagnostic support simplify manufacturing test and field diagnostics.

Why Choose A54SX72A-2FGG256?

The A54SX72A-2FGG256 positions itself as a midsize, nonvolatile FPGA that combines substantial logic capacity with flexible, mixed-voltage I/O and integrated security features. Its combination of approximately 108,000 system gates, 6,036 logic elements and up to 203 user I/Os makes it suitable for designs that need a balance of logic resources and dense board-level connectivity without external configuration memory.

Choose this device for applications that require predictable timing control, on-board IP protection, PCI-compatible interfaces and robust testability in a compact 256-FBGA package. Its commercial-grade temperature rating and RoHS-compliant packaging align it with mainstream embedded and electronic system designs requiring proven, field-deployable FPGA functionality.

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