AFS1500-FG676

The AFS1500-FG676 is a Fusion® Field Programmable Gate Array (FPGA) in a 676-ball BGA package that provides a combination of programmable logic, on-chip memory, and high I/O density. It includes 38,400 logic elements (cells), approximately 0.276 Mbits of embedded memory, 252 I/O pins and an internal gate count of 1,500,000.

Packaged in a 676-FBGA (27 × 27 mm) surface-mount device with a 1.425 V to 1.575 V core supply range and commercial operating temperature of 0 °C to 85 °C, the device targets commercial-grade designs requiring moderate embedded memory, significant logic capacity, and substantial I/O connectivity.

Key Features

• Core Logic  Includes 38,400 logic elements (cells) and approximately 1,500,000 gates for implementing complex programmable logic functions.
• Embedded Memory  Total on-chip RAM of 276,480 bits, providing approximately 0.276 Mbits of embedded memory for FIFOs, buffers and small data stores.
• I/O Density  252 general-purpose I/O pins to support extensive external interfacing and parallel connectivity.
• Package & Mounting  Available in a 676-FBGA (27 × 27 mm) surface-mount package for compact board-level integration.
• Power  Core voltage supply range of 1.425 V to 1.575 V to match contemporary FPGA power domains.
• Temperature & Grade  Commercial grade operation with an ambient temperature range of 0 °C to 85 °C for standard commercial applications.
• Regulatory Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Logic-Intensive Embedded Systems  Leverage 38,400 logic elements and 1,500,000 gates to implement custom digital logic and control functions.
• High-IO Interface Designs  Use 252 I/O pins to connect multiple peripherals or parallel interfaces where high pin count is required.
• On-Board Data Buffering  Approximately 0.276 Mbits of embedded RAM supports buffering, small FIFOs and temporary data storage on-chip.

Unique Advantages

• Substantial Logic Capacity: 38,400 logic elements and 1,500,000 gates provide ample programmable logic resource for complex designs.
• Compact High-Density Package: 676-FBGA (27 × 27 mm) package enables a high pin-count implementation in a compact surface-mount footprint.
• Significant I/O Resources: 252 I/O pins simplify integration with multiple external devices and parallel interfaces without external multiplexing.
• On-Chip Memory: Approximately 0.276 Mbits of embedded RAM lets you implement local buffers and small data structures without external memory.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to meet typical commercial application environments.
• RoHS Compliant: Conforms to RoHS directives for environmentally conscious manufacturing and assembly.

Why Choose AFS1500-FG676?

The AFS1500-FG676 Fusion® FPGA brings together a sizable logic resource set, embedded memory and a high I/O count in a compact 676-FBGA package, providing a balanced platform for commercial-grade programmable designs. Its combination of 38,400 logic elements, approximately 0.276 Mbits of on-chip RAM and 252 I/Os supports a variety of mid-density digital functions where board space and I/O density are important considerations.

Designed for commercial temperature operation and RoHS-compliant manufacturing, the AFS1500-FG676 is suitable for engineers and procurement teams seeking a reliable, high-density FPGA option with defined core voltage requirements and surface-mount packaging for standard PCB assembly processes.

Request a quote or submit an inquiry for the AFS1500-FG676 to assess availability and pricing for your next design.