AFS1500-FGG256

IC FPGA 119 I/O 256FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 119 276480 256-LBGA

Quantity 540 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O119Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs38400Number of Logic Elements/Cells38400
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits276480

Overview of AFS1500-FGG256 – Fusion® FPGA, 1,500,000 gates, 38,400 logic elements, ~0.276 Mbits RAM, 256-LBGA

The AFS1500-FGG256 is a Fusion® Field Programmable Gate Array (FPGA) IC providing 1,500,000 gates, 38,400 logic elements and approximately 0.276 Mbits of embedded memory. It exposes 119 user I/O and is delivered in a 256-LBGA surface-mount package (256-FPBGA, 17×17).

Designed for commercial-grade applications, the device operates from a 1.425 V to 1.575 V supply and across an operating temperature range of 0 °C to 85 °C. The part is RoHS compliant, enabling deployment where lead-free compliance is required.

Key Features

  • Core Capacity  1,500,000 gates and 38,400 logic elements provide substantial programmable logic resources for complex logic and control implementations.
  • Embedded Memory  Approximately 276,480 bits (≈0.276 Mbits) of on-chip RAM to support buffering, state storage, and embedded data structures without external memory.
  • I/O  119 available I/O pins to support multiple interfaces and peripheral connections within a single device.
  • Package & Mounting  256-LBGA (256-FPBGA, 17×17) surface-mount package for compact, high-density PCB integration.
  • Power  Specified supply range of 1.425 V to 1.575 V to match precise core-voltage requirements.
  • Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operation.
  • Environmental  RoHS compliant, supporting lead-free assembly and regulatory requirements.

Unique Advantages

  • High logic density: 1,500,000 gates and 38,400 logic elements let you implement complex algorithms and state machines on a single FPGA, reducing the need for external ASICs or discrete logic.
  • On-chip memory: Approximately 0.276 Mbits of embedded RAM reduces external memory dependence for buffering and temporary storage.
  • Flexible I/O count: 119 I/O pins enable integration of multiple interfaces and peripherals without additional interface chips.
  • Compact, manufacturable package: 256-LBGA surface-mount package supports high-density board layouts and automated assembly processes.
  • Predictable supply requirements: Narrow core voltage range (1.425 V–1.575 V) simplifies power-supply design and sequencing.
  • Regulatory-ready: RoHS compliance facilitates lead-free production and global regulatory adherence.

Why Choose AFS1500-FGG256?

The AFS1500-FGG256 combines a large programmable fabric—1,500,000 gates and 38,400 logic elements—with on-chip memory and a wide complement of I/O in a compact 256-LBGA package. Its defined supply range and commercial operating temperature rating make it suitable for mainstream embedded designs that require significant on-chip logic and memory integration.

Choose this FPGA when your design needs substantial reprogrammable logic capacity, multiple I/O channels, and a surface-mount package optimized for high-density PCB layouts. The AFS1500-FGG256 delivers a balance of logic resources, embedded memory, and manufacturable packaging for commercial-grade electronic products.

Request a quote or submit an inquiry for pricing and availability of the AFS1500-FGG256 to start your procurement process.

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