AFS1500-FGG484

The AFS1500-FGG484 is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology delivering a balanced mix of configurable logic, on-chip memory and generous I/O in a compact BGA package. It provides 38,400 logic elements, approximately 0.28 Mbits of embedded memory and 223 I/O pins for designs that require significant programmable logic capacity and flexible interfacing.

Engineered for commercial-grade applications, the device operates from a supply voltage range of 1.425 V to 1.575 V and across an ambient temperature range of 0 °C to 85 °C, making it suitable for a variety of standard embedded system designs.

Key Features

• Core Logic 38,400 logic elements providing up to 1,500,000 gates of programmable logic for implementing custom digital functions and complex state machines.
• Embedded Memory Approximately 0.28 Mbits (276,480 bits) of on-chip RAM to support buffering, FIFOs and small data stores without external memory.
• I/O Capacity 223 user I/O pins to support broad interfacing needs for sensors, peripherals and external devices.
• Package & Mounting 484-FPBGA (23×23) package case (484-BGA) in a surface-mount form factor for compact board integration and high-density routing.
• Power Operates from a supply voltage range of 1.425 V to 1.575 V, enabling consistent core power planning and regulation on the host board.
• Operating Grade Commercial temperature range rated from 0 °C to 85 °C for standard embedded and industrial-adjacent applications.
• Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Custom digital logic — Implement application-specific finite state machines, protocol handlers and glue logic using the device’s high logic capacity.
• I/O-intensive interfaces — Use the 223 I/O pins to bridge multiple external devices and peripherals without extensive external multiplexing.
• Embedded buffering and small-data storage — Leverage the on-chip RAM for FIFOs, temporary buffers and local data storage to reduce external memory needs.
• Prototyping and system integration — Compact BGA packaging and plentiful logic resources make the device suitable for board-level prototyping and integration into space-constrained systems.

Unique Advantages

• High logic density: 38,400 logic elements and 1,500,000 gates provide capacity for complex digital designs without immediate migration to larger devices.
• Ample embedded memory: Approximately 0.28 Mbits of on-chip RAM reduces dependency on external memory for moderate buffering and data handling.
• Generous I/O: 223 I/O pins support extensive peripheral connectivity and flexible interface design options.
• Compact BGA package: 484-FPBGA (23×23) offers a high pin-count in a space-efficient surface-mount package for dense board layouts.
• Straightforward power requirements: Narrow core supply range (1.425 V–1.575 V) simplifies power-supply planning and regulation design.
• RoHS compliant: Meets common environmental requirements for modern electronics manufacturing.

Why Choose AFS1500-FGG484?

The AFS1500-FGG484 balances substantial programmable logic resources, embedded memory and extensive I/O in a compact 484-BGA footprint from Microchip Technology. Its combination of 38,400 logic elements, approximately 0.28 Mbits of on-chip RAM and 223 I/O pins makes it a practical choice for designers needing mid-to-high density FPGA capability in commercial-temperature applications.

This device is well suited to teams developing portable prototypes, embedded controllers and interface-rich products that require a tightly integrated FPGA solution with predictable power and packaging characteristics. Choosing the AFS1500-FGG484 provides a scalable and robust building block within Microchip’s Fusion FPGA family for medium-complexity programmable logic designs.

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