AFS1500-FGG676I

The AFS1500-FGG676I is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology presented in a 676-BGA package. It delivers a combination of logic density, on-chip memory, and a high I/O count in an industrial-grade device suitable for demanding embedded and industrial applications.

With 38,400 logic elements and approximately 0.276 Mbits of embedded memory, this device targets designs that require significant programmable logic, substantial I/O connectivity, and operation across an industrial temperature range.

Key Features

• Logic Capacity  Provides 38,400 logic elements and approximately 1,500,000 gates for implementing complex programmable logic functions.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM (276,480 bits) to support frame buffers, FIFOs, and local data storage.
• I/O Density  252 user I/Os to accommodate broad peripheral and interface requirements without external expanders.
• Power Supply  Operates from a supply range of 1.425 V to 1.575 V to match system power rails and design constraints.
• Package & Mounting  Available in a 676-BGA package (supplier device package: 676-FBGA, 27×27) with surface-mount mounting for compact board integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, supporting deployment in industrial environments.
• Compliance  RoHS compliant, meeting common environmental directives for electronic components.

Typical Applications

• Industrial Control & Automation  Use the device where industrial-grade temperature range and high I/O count are needed for sensor and actuator interfacing or real-time control logic.
• Embedded Systems  Implement custom logic, peripheral aggregation, and protocol bridging leveraging the device’s logic density and on-chip memory.
• Communications & Interfaces  Deploy the FPGA for protocol handling and parallel I/O needs where multiple interfaces must be supported simultaneously.

Unique Advantages

• Substantial Logic Resources: 38,400 logic elements and 1,500,000 gates allow implementation of complex logic architectures on a single device.
• Generous I/O Count: 252 user I/Os reduce the need for external I/O expansion, simplifying board design and lowering BOM cost.
• Embedded Memory On-Chip: Approximately 0.276 Mbits of RAM supports local buffering and temporary data storage without immediate external memory.
• Industrial-Grade Operation: −40 °C to 100 °C rating and RoHS compliance make the device appropriate for industrial deployments and regulated production environments.
• Compact BGA Footprint: 676-BGA (27×27) packaging provides a dense solution for space-constrained PCBs while supporting surface-mount assembly.

Why Choose AFS1500-FGG676I?

The AFS1500-FGG676I balances significant programmable logic capacity, embedded memory, and a high I/O count in a single industrial-grade FPGA package from Microchip Technology. Its electrical and thermal specifications make it suitable for designs that require reliable operation across a wide temperature range while maintaining compact board integration.

Choose this device for applications that demand integrated logic density, extensive peripheral connectivity, and a package that supports surface-mount PCB assembly. The combination of specifications provides a scalable platform for mid- to high-complexity embedded and industrial designs.

Request a quote or submit an inquiry to check availability and pricing for the AFS1500-FGG676I and to discuss volume needs or lead-time requirements.