AFS250-1FG256I

The AFS250-1FG256I is a Fusion® Field Programmable Gate Array (FPGA) IC offering 6,144 logic elements, 36,864 bits of total on-chip RAM, and approximately 250,000 gates. It is supplied in a compact 256-LBGA (256-FPBGA, 17×17) surface-mount package and rated for industrial operation.

With 114 user I/O pins and a core supply range of 1.425 V to 1.575 V, this device targets embedded designs that require configurable logic capacity, moderate on-chip memory, and extended temperature operation from −40 °C to 100 °C.

Key Features

• Core & Logic — 6,144 logic elements delivering approximately 250,000 gates of programmable logic capacity for implementing custom digital functions.
• Embedded Memory — 36,864 bits of total on-chip RAM to support buffering, small lookup tables, and state storage within user designs.
• I/O — 114 user I/O pins provided for flexible interfacing to external devices and peripherals.
• Power — Core supply voltage range of 1.425 V to 1.575 V to match target system power rails and design requirements.
• Package & Mounting — 256-LBGA (supplier package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board integration.
• Temperature & Grade — Industrial grade device with an operating temperature range of −40 °C to 100 °C for use in extended-environment applications.
• Regulatory — RoHS compliant, meeting common environmental requirements for lead-free assembly.

Unique Advantages

• Balanced logic and memory capacity: 6,144 logic elements combined with 36,864 bits of on-chip RAM provide a well-matched resource set for mid-range programmable functions without external memory in many designs.
• Significant gate density: Approximately 250,000 gates enable implementation of complex state machines, glue logic, and custom peripheral functions.
• Robust industrial operation: Rated from −40 °C to 100 °C and identified as industrial grade for applications that require extended temperature performance.
• Compact BGA footprint: 256-LBGA / 256-FPBGA (17×17) package supports space-constrained PCBs while maintaining a high pin count.
• Controlled core voltage: Narrow supply range (1.425 V–1.575 V) simplifies power-supply selection for predictable logic performance.
• Environmentally compliant: RoHS compliance supports lead-free manufacturing and regulatory conformance.

Why Choose AFS250-1FG256I?

The AFS250-1FG256I positions itself as a mid-range Fusion® FPGA solution that combines a substantial logic element count, measurable on-chip RAM, and a high gate count in a compact 256-LBGA package. Its industrial temperature rating and RoHS compliance make it suitable for designs requiring reliable operation across an extended temperature range and adherence to environmental standards.

This device is well suited to embedded designers and procurement teams looking for a configurable logic IC with defined I/O capacity, controlled power requirements, and a compact footprint. It provides a scalable, verifiable platform for implementing custom digital logic while supporting industrial operating conditions.

Request a quote or submit a pricing inquiry to evaluate AFS250-1FG256I availability and lead times for your next design.