AFS250-2FG256

The AFS250-2FG256 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology, offered in a 256-LBGA package. It provides a balance of programmable logic, on-chip memory and I/O count for commercial embedded applications.

With 6,144 logic elements, approximately 36.9 Kbits of embedded RAM, 114 I/O pins and a gate count of 250,000, this device targets designs requiring mid-range configurable logic density in a surface-mount 256-FPBGA (17×17) package. It operates on a supply range of 1.425 V to 1.575 V and is specified for commercial temperature operation (0 °C to 85 °C).

Key Features

• Logic Capacity — 6,144 logic elements (CLBs) providing the programmable fabric for custom digital functions and control logic.
• On-chip Memory — 36,864 bits of total RAM (approximately 36.9 Kbits) for LUTs, buffers and small embedded data storage.
• I/O Count — 114 available I/O pins to interface with peripherals, sensors and external devices.
• Gate Density — Approximately 250,000 gates for implementing a variety of combinational and sequential logic structures.
• Power — Core supply range of 1.425 V to 1.575 V to match system power rails and regulatory requirements.
• Package & Mounting — 256-LBGA (256-FPBGA, 17×17) surface-mount package for compact board-level integration.
• Operating Range — Commercial grade operation from 0 °C to 85 °C, suitable for business and consumer electronics environments.
• RoHS Compliance — Device is RoHS compliant for environmental regulatory alignment.

Unique Advantages

• Balanced logic and memory resources: 6,144 logic elements paired with approximately 36.9 Kbits of RAM enable compact implementations of control, glue logic and state machines without external memory for small data needs.
• Ample I/O for peripheral integration: 114 I/O pins provide flexibility to connect multiple sensors, interfaces and user I/O without extensive external multiplexing.
• Compact, industry-standard package: The 256-FPBGA (17×17) surface-mount package simplifies placement on dense PCBs while supporting reliable soldered connections.
• Defined commercial operating window: Specified 0 °C to 85 °C operation and RoHS compliance make procurement and qualification straightforward for commercial product lines.
• Straightforward power requirements: A narrow core voltage range (1.425 V–1.575 V) eases power-supply design and voltage regulation for the FPGA core.

Why Choose AFS250-2FG256?

The AFS250-2FG256 positions itself as a mid-density, commercial-grade Fusion® FPGA option that combines a practical mix of logic elements, on-chip RAM and I/O capability in a compact 256-LBGA package. Its specification set—6,144 logic elements, ~36.9 Kbits of RAM, 114 I/Os and 250,000 gates—makes it suitable for embedded designs that require configurable logic and moderate on-chip resources while staying within commercial temperature limits.

For teams designing consumer and commercial electronics that need a reliable programmable logic device with clear electrical and thermal specifications, the AFS250-2FG256 offers a defined, verifiable set of capabilities and regulatory compliance to support product development and procurement.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the AFS250-2FG256.