AFS250-2FGG256

The AFS250-2FGG256 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology, delivered in a 256-LBGA package. It provides a compact, commercial-grade programmable logic solution with 6,144 logic elements (LEs), approximately 0.037 Mbits of embedded memory, and up to 114 I/O pins.

Designed for surface-mount board assembly, the device operates from a 1.425 V to 1.575 V supply and is rated for commercial operating temperatures from 0 °C to 85 °C. Its combination of logic density, I/O count and compact package targets applications that require moderate gate counts and on-chip memory in a small footprint.

Key Features

• Core Logic — 6,144 logic elements (LEs) and a logic capacity of 250,000 gates, enabling implementation of medium-complexity digital designs.
• Embedded Memory — 36,864 bits of on-chip RAM, suitable for small buffers, state machines, and configuration storage.
• I/O — Up to 114 general-purpose I/O pins to support multiple external interfaces and peripheral connections.
• Power — Single supply operation with a specified voltage range of 1.425 V to 1.575 V for the core.
• Package & Mounting — 256-LBGA (supplier package: 256-FPBGA, 17 × 17 mm) optimized for surface-mount assembly and compact board layouts.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant, suitable for designs requiring lead-free manufacturing processes.

Typical Applications

• Custom digital logic and glue: Implement medium-complexity glue logic and protocol bridging using 6,144 logic elements and up to 114 I/O pins.
• On-board peripheral control: Integrate control functions and small data buffering with 36,864 bits of embedded memory and flexible I/O.
• Compact FPGA-based modules: Use the 256-LBGA package for space-constrained board designs that require a balance of logic density and I/O.

Unique Advantages

• Balanced logic density: 6,144 logic elements and 250,000 gates provide a mid-level integration point for designs that outgrow small CPLDs but do not require high-end FPGAs.
• Compact board footprint: 256-LBGA (17 × 17 mm) package supports dense PCB layouts and surface-mount assembly processes.
• Straightforward power requirements: Narrow core supply range (1.425 V to 1.575 V) simplifies power-supply design for the FPGA core.
• Ample I/O capability: Up to 114 I/O pins enable support for multiple peripherals and interface signals without external I/O expanders.
• Commercial-grade temperature rating: 0 °C to 85 °C suits a wide range of consumer and commercial electronic applications.
• RoHS compliant: Meets lead-free manufacturing requirements for modern production processes.

Why Choose AFS250-2FGG256?

The AFS250-2FGG256 delivers a practical combination of logic resources, embedded memory and I/O in a compact 256-LBGA package. Its 6,144 logic elements and 250,000-gate capacity make it appropriate for medium-complexity programmable designs where board space and predictable power requirements are important considerations.

As a commercial-grade, RoHS-compliant Fusion® FPGA from Microchip Technology, this device is suited for development teams and OEMs seeking a reliable, mid-density programmable logic solution that integrates well into surface-mount production flows and standard commercial operating environments.

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