AFS250-1FGG256I

The AFS250-1FGG256I is a Fusion® Field Programmable Gate Array from Microchip Technology designed for industrial embedded applications. It provides a programmable logic fabric with 6,144 logic elements, 250,000 gates and 36,864 bits of on-chip RAM to implement custom logic, interface bridging and control functions.

This device supports up to 114 user I/O pins, is supplied over a 1.425–1.575 V range, and is packaged in a compact 256-ball L-BGA (256-FPBGA, 17×17) surface-mount package with an industrial operating temperature range of −40 °C to 100 °C.

Key Features

• Logic Capacity — 6,144 logic elements (CLBs) and approximately 250,000 gates provide moderate programmable logic resources for glue logic, state machines and control functions.
• On-chip Memory — 36,864 bits of embedded RAM for buffering, FIFOs or small data tables directly within the FPGA fabric.
• I/O Count — Up to 114 user I/O pins to support multiple peripheral interfaces and custom signal routing.
• Power Supply — Operates from a focused core voltage range of 1.425 V to 1.575 V for compatibility with controlled power domains.
• Package & Mounting — 256-LBGA package (supplier package 256-FPBGA, 17×17) in a surface-mount form factor for compact board-level integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• RoHS Compliant — Conforms to RoHS environmental requirements for lead-free designs.

Typical Applications

• Industrial Control Systems — Implement control logic, I/O expansion and protocol bridging in industrial automation equipment that requires an industrial temperature rating and surface-mount packaging.
• Sensor and Data Acquisition — Aggregate and preprocess sensor signals using embedded RAM and programmable logic before passing data to a host processor.
• Custom Interface Modules — Create tailored interface glue logic and signal translators using up to 114 I/O for diverse peripheral connectivity.
• OEM Embedded Designs — Integrate application-specific logic and small on-chip memory into compact PCBs with the 256-ball L-BGA package.

Unique Advantages

• Moderate Logic Density: 6,144 logic elements and 250,000 gates provide a balanced resource set for consolidating discrete logic and implementing custom functions.
• On-chip Memory for Local Storage: 36,864 bits of embedded RAM reduce dependence on external memory for small buffers and lookup tables.
• Generous I/O Count: 114 user I/O pins allow flexible interfacing with sensors, peripherals and other system components.
• Industrial Reliability: Specified for −40 °C to 100 °C operation and RoHS compliance to support deployment in industrial environments.
• Compact, Surface-Mount Package: 256-LBGA (256-FPBGA, 17×17) enables space-efficient board layouts while maintaining routing capacity for numerous I/O.
• Tight Core Voltage Window: 1.425–1.575 V supply range aids integration into controlled power architectures.

Why Choose AFS250-1FGG256I?

The AFS250-1FGG256I is positioned for engineers who need a programmable, industrial-grade FPGA with a practical balance of logic, memory and I/O. Its 6,144 logic elements, 36,864 bits of on-chip RAM and 114 I/O pins make it suitable for embedded control, interface consolidation and OEM modules where a compact, surface-mount solution is required.

Backed by Microchip Technology and RoHS compliant, this device delivers programmable flexibility, industrial temperature tolerance and a compact 256-LBGA package to simplify board-level integration and support long-term product deployment.

Request a quote or submit an inquiry to get pricing and availability for the AFS250-1FGG256I.