AFS250-2FGG256I

The AFS250-2FGG256I is a Fusion® field programmable gate array (FPGA) from Microchip Technology, offering a balanced set of programmable logic, on-chip memory and I/O for embedded and industrial designs. With 6,144 logic elements, approximately 36,864 bits of embedded memory, and 114 I/O pins, this device targets applications that require moderate logic capacity, flexible interfacing and industrial temperature operation.

Packaged in a 256-LBGA / 256-FPBGA (17x17) surface-mount package and designed for an industrial temperature range, the AFS250-2FGG256I provides integration and environmental compliance for commercial and industrial deployments.

Key Features

• Core Logic  6,144 logic elements providing programmable logic resources for custom digital designs and glue logic implementation.
• Embedded Memory  Approximately 36,864 bits of on-chip RAM (≈0.037 Mbits) to support buffering, small FIFOs and local data storage.
• I/O Resources  114 user I/O pins for flexible peripheral, sensor and interface connectivity in compact system designs.
• Gate Count  Approximately 250,000 gates enabling moderate-complexity digital implementations.
• Power  Core supply voltage range of 1.425 V to 1.575 V to match low-voltage system domains.
• Package & Mounting  256-LBGA package (supplier device package: 256-FPBGA (17x17)), surface-mount for high-density PCB integration.
• Industrial Temperature Range  Rated for operation from −40°C to 100°C to meet industrial environmental requirements.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Automation  Implement control logic, custom timing and I/O aggregation for machine control and factory automation systems operating across industrial temperatures.
• Embedded Control & Glue Logic  Replace discrete logic or microcontroller peripheral glue with programmable logic to consolidate functions and simplify PCB design.
• Sensor Interfacing & Data Acquisition  Use the device’s I/O density and on-chip memory for sensor multiplexing, pre-processing and buffering in data acquisition front ends.
• Test & Measurement Equipment  Create custom digital signal conditioning, protocol handling and timing functions in compact instrument designs.

Unique Advantages

• Balanced Logic and Memory:  6,144 logic elements paired with ~36.9 kbits of embedded RAM offer the right mix for moderate-complexity digital functions without excess overhead.
• Ample I/O for Peripheral Integration:  114 I/O pins simplify connections to sensors, actuators and external interfaces, reducing the need for external I/O expanders.
• Industrial-Rated Operation:  Specified operation from −40°C to 100°C supports deployment in industrial environments.
• Compact, Surface-Mount Package:  256-LBGA / 256-FPBGA (17x17) package enables dense PCB layouts while maintaining a standard form factor for assembly.
• Low-Voltage Core Compatibility:  Core supply range of 1.425 V to 1.575 V aligns with modern low-voltage system domains.
• RoHS Compliant:  Meets environmental compliance requirements for many industrial and commercial applications.

Why Choose AFS250-2FGG256I?

The AFS250-2FGG256I positions itself as a compact, industrial-grade FPGA option that combines a practical number of logic elements, embedded memory and a sizable I/O complement in a space-efficient 256-LBGA package. Its operating temperature range and RoHS compliance make it suitable for long-term deployment in industrial and embedded systems where reliability and environmental compliance matter.

This device is well suited for engineers and procurement teams seeking a programmable solution to consolidate discrete logic, implement custom interfaces or add moderate digital processing capability while maintaining a small PCB footprint and industrial temperature operation, supported by Microchip Technology’s Fusion family.

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