AFS250-FGG256I

The AFS250-FGG256I is a Fusion® field programmable gate array (FPGA) offered in a compact 256-LBGA package. It provides a mid-range programmable logic resource set suitable for industrial electronic applications requiring flexible I/O, on-chip memory and a defined logic capacity.

With 6,144 logic elements, 114 general-purpose I/Os, approximately 0.037 Mbits of embedded memory and a 250,000-gate equivalent fabric, this device targets designs that need moderate integration, predictable operating conditions and surface-mount packaging.

Key Features

• Logic Capacity  6,144 logic elements (cells) supporting approximately 250,000 equivalent gates for mid-range programmable logic designs.
• Embedded Memory  Total on-chip RAM of 36,864 bits, providing localized storage for buffering, state machines and small data structures.
• I/O Density  114 general-purpose I/Os to connect with sensors, peripherals and external interfaces in compact designs.
• Supply Voltage  Core operating voltage range of 1.425 V to 1.575 V for compatibility with targeted system power rails.
• Package & Mounting  256-LBGA package (supplier device package: 256-FPBGA, 17×17) with surface-mount mounting suitable for PCB assembly in space-constrained layouts.
• Operating Range  Industrial-grade device rated for operation from −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Programmable logic for control, sequencing and I/O aggregation in equipment that requires operation over −40 °C to 100 °C.
• Sensor and Peripheral Interfaces  Multiple I/Os and embedded RAM support interfacing, preprocessing and aggregation of sensor data in compact systems.
• Embedded System Glue Logic  Use as custom bus adapters, protocol bridges and timing logic where moderate gate count and flexible I/O are needed.

Unique Advantages

• Balanced Logic and Memory:  6,144 logic elements paired with 36,864 bits of RAM provide a balance of programmable resources for state machines, controllers and glue logic.
• Ample I/O Count:  114 I/Os enable direct connectivity to multiple peripherals and sensors without extensive external I/O expansion.
• Compact, Assembly-Friendly Package:  256-LBGA (256-FPBGA, 17×17) offers a small footprint and surface-mount compatibility for space-constrained PCBs.
• Industrial Temperature Rating:  Specified operation from −40 °C to 100 °C supports deployment in industrial environments.
• Defined Core Voltage Window:  1.425–1.575 V supply range enables predictable power design and rail planning.
• Regulatory Compliance:  RoHS compliant for environmental and supply-chain requirements.

Why Choose AFS250-FGG256I?

The AFS250-FGG256I positions itself as a reliable, mid-range Fusion® FPGA option for engineers designing industrial and embedded systems that require a compact package, solid I/O count and a known logic/memory footprint. Its combination of 6,144 logic elements, approximately 0.037 Mbits of embedded RAM and 114 I/Os makes it suitable for control, interfacing and glue-logic roles where predictable performance and industrial temperature capability matter.

Choose this device when you need moderate programmable capacity in a surface-mount 256-LBGA package with defined power and temperature specifications, and when RoHS compliance is required for your product build.

Request a quote or submit a parts inquiry to obtain pricing and availability for AFS250-FGG256I.