AFS600-1FG256K

The AFS600-1FG256K is a Fusion® Field Programmable Gate Array from Microchip Technology, offered in a 256-ball LBGA package. It delivers a balance of on-chip logic and I/O density in a military-grade FPGA targeted at applications that require robust temperature range and reliable packaging.

With 13,824 logic elements, approximately 0.11 Mbits of embedded memory and 119 I/O pins, this device is suited for designs that demand moderate gate count, compact packaging, and operation across extended temperature extremes.

Key Features

• Core Logic 13,824 logic elements providing approximately 600,000 gates to implement custom digital functions and control logic.
• Embedded Memory Approximately 0.11 Mbits of on-chip RAM (110,592 total bits) for small data buffering, state storage, and control tables.
• I/O Capacity 119 available I/O pins for interfacing with peripherals, sensors, and external logic devices.
• Power Supply Specified core voltage range of 1.425 V to 1.575 V for predictable power planning and system integration.
• Package & Mounting 256-LBGA (supplier device package: 256-FPBGA, 17×17) in a surface-mount format to support compact board layouts.
• Temperature & Grade Military grade device rated for operation from -55 °C to 100 °C, addressing applications that require extended temperature performance.
• Environmental Compliance RoHS compliant to meet current environmental and manufacturing requirements.

Typical Applications

• Military and Defense Systems — Suited for control and signal-processing tasks in systems requiring military-grade temperature range and reliability.
• Embedded Control — Implements custom state machines, protocol bridging, and control logic using available logic elements and I/O.
• Ruggedized Electronics — Compact LBGA packaging and surface-mount mounting support space-constrained, rugged electronic assemblies.

Unique Advantages

• Balanced Logic and Memory: Combines 13,824 logic elements with on-chip RAM to support both combinational and small buffering workloads without external memory in some designs.
• Substantial I/O Count: 119 I/O pins provide flexibility for peripheral interfacing and mixed-signal front-end connectivity.
• Military Temperature Rating: Operating range from -55 °C to 100 °C makes the device appropriate for applications that must tolerate extreme temperatures.
• Compact Package: 256-LBGA / 256-FPBGA (17×17) enables high-density board designs while maintaining a surface-mount form factor.
• Standards-Friendly Compliance: RoHS compliance supports environmentally conscious manufacturing and procurement requirements.

Why Choose AFS600-1FG256K?

The AFS600-1FG256K positions itself as a military-grade Fusion® FPGA option that balances logic density, I/O count, and compact packaging. Its specified core voltage range and extended temperature rating make it suitable for designs where predictable electrical behavior and thermal robustness are required.

Choose this device when your design requires moderate gate capacity, a meaningful number of I/Os, and certified environmental compliance, all in a compact 256-LBGA surface-mount package backed by Microchip Technology.

Request a quote or submit an inquiry to obtain pricing and availability for the AFS600-1FG256K and to discuss how this FPGA can fit your next design.