AFS600-1FG256

The AFS600-1FG256 is a Fusion® field programmable gate array (FPGA) from Microchip Technology intended for programmable logic implementations. It integrates 600,000 gates and 13,824 logic elements with approximately 0.11 Mbits of embedded memory and 119 I/Os in a compact 256-LBGA surface-mount package.

Designed as a commercial-grade FPGA, the device operates from a 1.425 V to 1.575 V supply and is specified for 0°C to 85°C operation. It is RoHS compliant for environmental regulation alignment.

Key Features

• Core Logic 600,000 gates implemented across 13,824 logic elements to support mid-density programmable logic designs.
• Embedded Memory Approximately 0.11 Mbits of on-chip RAM for local data storage and buffering within user logic.
• I/O Count 119 general-purpose I/Os to accommodate multiple peripheral and interface connections.
• Power Narrow supply-voltage window of 1.425 V to 1.575 V for controlled power-system design.
• Package & Mounting 256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact PCB layouts.
• Temperature & Grade Commercial-grade device rated for 0°C to 85°C operation.
• Compliance RoHS compliant to support environmental and regulatory requirements.

Typical Applications

• Programmable logic integration Implement custom digital logic and state machines using the device’s logic elements and gates.
• Interface consolidation Aggregate and bridge multiple signals or peripherals using the 119 available I/Os.
• Prototyping and development Compact 256-LBGA package and mid-range logic resources suit evaluation boards and prototype systems.
• Custom control and processing On-chip memory and logic capacity enable implementation of tailored control and signal-processing functions.

Unique Advantages

• Balanced logic density: 600,000 gates and 13,824 logic elements provide a clear resource profile for mid-density FPGA designs.
• On-chip memory: Approximately 0.11 Mbits of embedded RAM reduces dependence on external memory for local buffers and state storage.
• Ample I/O: 119 I/Os allow flexible connectivity and peripheral consolidation without sacrificing package compactness.
• Compact package: 256-LBGA / 256-FPBGA (17×17) surface-mount footprint supports space-constrained PCB implementations.
• Predictable power requirements: Defined 1.425–1.575 V supply range simplifies power-supply design considerations.
• Regulatory alignment: RoHS compliance supports environmentally-conscious product planning.

Why Choose AFS600-1FG256?

The AFS600-1FG256 positions itself as a mid-density Fusion® FPGA option that consolidates logic, memory, and I/O in a compact 256-LBGA package. Its combination of 600,000 gates, 13,824 logic elements and approximately 0.11 Mbits of embedded memory delivers a clear resource balance for designs that require programmable logic with moderate I/O connectivity.

As a commercial-grade, RoHS-compliant device from Microchip Technology with defined supply and temperature ranges, the AFS600-1FG256 is suitable for development and deployment in applications where controlled power, compact packaging, and predictable environmental ratings are primary considerations.

Request a quote or submit an inquiry to obtain pricing and availability for the AFS600-1FG256.