AFS250-FG256I

The AFS250-FG256I is a Fusion® Field Programmable Gate Array (FPGA) offered by Microchip Technology. It provides a balanced integration of programmable logic, on-chip memory and I/O resources in a compact 256-ball LBGA package targeted at industrial applications.

With 6,144 logic elements, approximately 36.9 kbits of embedded memory and 114 user I/O pins, the device is suited for designs that require moderate programmable logic capacity, deterministic voltage supply requirements and extended operating temperature range.

Key Features

• Core Logic 6,144 logic elements and approximately 250,000 gates provide the programmable logic resources for custom digital functions and state machines.
• Embedded Memory Approximately 36.9 kbits of on-chip RAM (36,864 bits) for buffering, small data structures or LUT-based storage within user designs.
• I/O Count 114 user I/O pins to interface with sensors, peripherals and external devices in multi-signal systems.
• Package and Mounting 256-LBGA package (supplier package: 256-FPBGA, 17×17) designed for surface-mount assembly in space-constrained boards.
• Power Specified supply voltage range of 1.425 V to 1.575 V for the core supply to support predictable system power budgeting and design.
• Temperature and Grade Industrial-grade device specified for operation from −40 °C to 100 °C, allowing deployment in a wide range of industrial environments.
• Regulatory Compliance RoHS-compliant to align with common environmental requirements for electronic assemblies.

Typical Applications

• Industrial Control and Automation — Leverage the industrial temperature rating and 114 I/O to implement sensor aggregation, motor control interfaces and custom control logic.
• Embedded Glue Logic — Use the available logic elements and on-chip RAM to combine functions, protocol conversion and timing logic in compact systems.
• Sensor and I/O Aggregation — The mix of I/O and logic resources supports aggregation, preprocessing and interfacing of multiple sensor signals before passing data to a host processor.
• Industrial Communication Interfaces — Implement deterministic, application-specific communication or bridging functions using the programmable logic and I/O resources.

Unique Advantages

• Moderate Logic Capacity: 6,144 logic elements enable substantial custom digital functions while keeping device complexity manageable for mid-size designs.
• Integrated On-Chip Memory: Approximately 36.9 kbits of embedded RAM reduces the need for external buffering in many control and interface tasks.
• Generous I/O Count: 114 user I/O pins provide flexibility for connecting multiple peripherals, sensors and user interfaces without additional components.
• Compact Surface-Mount Package: 256-LBGA (256-FPBGA, 17×17) minimizes PCB area while supporting robust assembly processes.
• Industrial Temperature Support: Rated from −40 °C to 100 °C to meet thermal requirements of factory, process and field-deployed equipment.
• RoHS Compliance: Environmentally compliant construction simplifies regulatory alignment for product builds.

Why Choose AFS250-FG256I?

The AFS250-FG256I positions itself as a reliable, industrial-grade FPGA option for mid-sized embedded designs where a balance of programmable logic, on-chip memory and I/O density is required. Its specified core voltage range and compact 256-LBGA package make it suitable for space-constrained boards that need predictable power and thermal behavior.

This part is well suited to engineers developing industrial control systems, I/O aggregation modules, protocol bridges and embedded glue logic that benefit from on-chip memory and a significant number of user I/Os. Choosing this device offers a straightforward path to integrate configurable digital functionality while keeping BOM and board area under control.

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