AFS600-1FG256I

The AFS600-1FG256I is a Fusion® field programmable gate array (FPGA) from Microchip Technology designed for programmable digital logic implementations. It provides a balance of logic density, on-chip memory and I/O count suitable for industrial embedded and control-oriented designs.

With 13,824 logic elements and approximately 0.11 Mbits of embedded memory, this FPGA supports custom logic, I/O interfacing and moderate on-chip data buffering within a compact 256-ball BGA package.

Key Features

• Core Logic  13,824 logic elements (cells) delivering a programmable fabric for custom digital functions and hardware-accelerated tasks.
• On-Chip Memory  Total RAM of 110,592 bits, approximately 0.11 Mbits of embedded memory for local buffering, state storage and small lookup tables.
• I/O Capacity  119 user I/O pins enabling connectivity to peripherals, sensors, and external interfaces.
• Logic Scale  Approximately 600,000 gates providing combinational and sequential resource capacity for integrated designs.
• Package & Mounting  256-LBGA (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board integration.
• Power  Core supply operating range from 1.425 V to 1.575 V for defined power-domain design.
• Operating Range  Industrial operating temperature range from −40 °C to 100 °C suitable for temperature-demanding environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control Systems  Programmable logic and I/O handling for control, monitoring and automation equipment that require industrial temperature capability.
• Embedded System Integration  Custom logic implementation, glue logic and interface adaptation for embedded platforms leveraging the device's I/O count and logic elements.
• Communications and Protocol Bridging  Protocol adaptation and custom data-path logic using on-chip memory and programmable gates to implement interface logic and buffering.

Unique Advantages

• High logic density:  13,824 logic elements and roughly 600,000 gates allow implementation of substantial custom logic without external ASICs.
• Compact, high-pin-count package:  256-LBGA package with 119 I/Os provides a small footprint while supporting multiple external connections.
• Industrial temperature qualification:  Rated from −40 °C to 100 °C for deployment in temperature-sensitive and industrial environments.
• Defined core supply range:  Operates from 1.425 V to 1.575 V, simplifying power-supply planning for the programmable core.
• On-chip memory for local buffering:  110,592 bits (≈0.11 Mbits) of embedded RAM for state, buffering and small data storage needs.
• RoHS compliant:  Conforms to RoHS requirements for lead-free designs.

Why Choose AFS600-1FG256I?

The AFS600-1FG256I delivers a balanced combination of programmable logic capacity, embedded memory and I/O density in a compact 256-LBGA package. Its industrial-grade temperature range and defined core voltage make it appropriate for embedded and control applications that require reliable operation across a wide thermal envelope.

This device is well suited to engineers and procurement teams seeking a programmable solution for mid-range logic implementations, on-board protocol adaptation and industrial I/O integration, offering long-term design flexibility through reprogrammable logic and embedded memory resources.

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