AFS600-1FG484K

IC FPGA 172 I/O 484FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA

Quantity 31 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeMilitaryOperating Temperature-55°C – 100°C
Package / Case484-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of AFS600-1FG484K – Fusion® Field Programmable Gate Array (484-BGA)

The AFS600-1FG484K is a Fusion® field programmable gate array (FPGA) from Microchip Technology offered in a 484-ball BGA package. It provides a combination of logic capacity, on-chip memory, and I/O density tailored for military-grade and rugged embedded applications.

With 600,000 gates, 13,824 logic elements and 172 I/O pins, this FPGA supports complex custom logic and high‑pin‑count designs while operating across a wide thermal range and a controlled core voltage window.

Key Features

  • Core Logic  600,000 gates and 13,824 logic elements deliver the programmable fabric required for complex digital functions and custom logic integration.
  • Embedded Memory  Approximately 0.11 Mbits of embedded memory (110,592 total RAM bits) for local buffering, state storage, and on‑chip data processing.
  • I/O Density  172 I/O pins to support multiple interfaces and high‑pin‑count board designs.
  • Package  484-BGA package (supplier device package: 484-FPBGA, 23 × 23 mm) for compact, surface‑mount installation with high pin count.
  • Power  Specified core supply voltage range of 1.425 V to 1.575 V for controlled power design and integration with system power rails.
  • Environmental & Grade  Military grade device with an operating temperature range of −55 °C to 100 °C and RoHS compliance for regulatory compatibility.
  • Mounting  Surface mount package suited for PCB assembly in compact system designs.

Typical Applications

  • Military and Aerospace Systems  Designed for military‑grade deployments where wide operating temperature and rugged component selection are required.
  • High‑Density I/O Control  Ideal for systems that require numerous external interfaces and signal routing thanks to 172 I/O pins.
  • Embedded Signal Processing and Custom Logic  Suitable for implementing custom processing blocks, protocol bridging, and control logic using 13,824 logic elements and 600,000 gates.
  • Rugged Embedded Systems  A choice for embedded platforms operating across a broad temperature range that need on‑chip memory and deterministic logic resources.

Unique Advantages

  • Substantial Logic Capacity: 600,000 gates and 13,824 logic elements enable complex designs without external programmable logic expansion.
  • Balanced On‑Chip Memory: Approximately 0.11 Mbits of embedded RAM provides local storage for buffering and state machines, reducing external memory needs.
  • High I/O Count in a Compact Package: 172 I/Os in a 484‑ball BGA (23 × 23 mm) deliver significant connectivity in a compact footprint.
  • Military‑Grade Thermal Range: Specified operation from −55 °C to 100 °C aligns the device with designs that must operate in harsh temperature environments.
  • Tightly Specified Core Voltage: The 1.425 V to 1.575 V supply range supports precise power budgeting and predictable operation across production units.
  • Regulatory Compliance: RoHS compliance supports use in regulated procurement and manufacturing environments.

Why Choose AFS600-1FG484K?

The AFS600-1FG484K positions itself as a military‑grade FPGA option combining significant logic resources, embedded memory, and a high I/O count in a compact 484‑BGA package. Its specified operating temperature range and RoHS compliance make it suitable for rugged embedded designs that demand deterministic behavior across harsh environments.

This device is intended for designers and programs that require a balance of programmable logic capacity, on‑chip memory, and extensive I/O within a controlled core voltage range—delivering a dependable building block for complex, reliability‑focused FPGA implementations.

Request a quote or submit an inquiry to check availability, pricing, and lead times for the AFS600-1FG484K. Our team can provide further procurement details and help evaluate this FPGA for your design requirements.

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