AFS600-1FG484K
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA |
|---|---|
| Quantity | 31 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Military | Operating Temperature | -55°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 172 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of AFS600-1FG484K – Fusion® Field Programmable Gate Array (484-BGA)
The AFS600-1FG484K is a Fusion® field programmable gate array (FPGA) from Microchip Technology offered in a 484-ball BGA package. It provides a combination of logic capacity, on-chip memory, and I/O density tailored for military-grade and rugged embedded applications.
With 600,000 gates, 13,824 logic elements and 172 I/O pins, this FPGA supports complex custom logic and high‑pin‑count designs while operating across a wide thermal range and a controlled core voltage window.
Key Features
- Core Logic 600,000 gates and 13,824 logic elements deliver the programmable fabric required for complex digital functions and custom logic integration.
- Embedded Memory Approximately 0.11 Mbits of embedded memory (110,592 total RAM bits) for local buffering, state storage, and on‑chip data processing.
- I/O Density 172 I/O pins to support multiple interfaces and high‑pin‑count board designs.
- Package 484-BGA package (supplier device package: 484-FPBGA, 23 × 23 mm) for compact, surface‑mount installation with high pin count.
- Power Specified core supply voltage range of 1.425 V to 1.575 V for controlled power design and integration with system power rails.
- Environmental & Grade Military grade device with an operating temperature range of −55 °C to 100 °C and RoHS compliance for regulatory compatibility.
- Mounting Surface mount package suited for PCB assembly in compact system designs.
Typical Applications
- Military and Aerospace Systems Designed for military‑grade deployments where wide operating temperature and rugged component selection are required.
- High‑Density I/O Control Ideal for systems that require numerous external interfaces and signal routing thanks to 172 I/O pins.
- Embedded Signal Processing and Custom Logic Suitable for implementing custom processing blocks, protocol bridging, and control logic using 13,824 logic elements and 600,000 gates.
- Rugged Embedded Systems A choice for embedded platforms operating across a broad temperature range that need on‑chip memory and deterministic logic resources.
Unique Advantages
- Substantial Logic Capacity: 600,000 gates and 13,824 logic elements enable complex designs without external programmable logic expansion.
- Balanced On‑Chip Memory: Approximately 0.11 Mbits of embedded RAM provides local storage for buffering and state machines, reducing external memory needs.
- High I/O Count in a Compact Package: 172 I/Os in a 484‑ball BGA (23 × 23 mm) deliver significant connectivity in a compact footprint.
- Military‑Grade Thermal Range: Specified operation from −55 °C to 100 °C aligns the device with designs that must operate in harsh temperature environments.
- Tightly Specified Core Voltage: The 1.425 V to 1.575 V supply range supports precise power budgeting and predictable operation across production units.
- Regulatory Compliance: RoHS compliance supports use in regulated procurement and manufacturing environments.
Why Choose AFS600-1FG484K?
The AFS600-1FG484K positions itself as a military‑grade FPGA option combining significant logic resources, embedded memory, and a high I/O count in a compact 484‑BGA package. Its specified operating temperature range and RoHS compliance make it suitable for rugged embedded designs that demand deterministic behavior across harsh environments.
This device is intended for designers and programs that require a balance of programmable logic capacity, on‑chip memory, and extensive I/O within a controlled core voltage range—delivering a dependable building block for complex, reliability‑focused FPGA implementations.
Request a quote or submit an inquiry to check availability, pricing, and lead times for the AFS600-1FG484K. Our team can provide further procurement details and help evaluate this FPGA for your design requirements.

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