AFS600-1FGG256K

The AFS600-1FGG256K is a Fusion® field programmable gate array from Microchip Technology, offering a mid-range logic capacity and on-chip memory in a 256-LBGA package. Designed for military-grade applications, it provides a combination of configurable logic, embedded RAM, and a substantial number of I/O for rugged embedded systems.

With 13,824 logic elements and approximately 0.11 Mbits of embedded memory, this device suits designs that require moderate logic density, multiple I/O channels, and extended operating temperature capability.

Key Features

• Logic Capacity: 13,824 logic elements providing flexible programmable resources for custom logic and state-machine implementations.
• Gate Count: 600,000 gates giving a reference for overall silicon complexity and resource scale.
• Embedded Memory: Approximately 0.11 Mbits of on-chip RAM (110,592 bits) for data buffering, small FIFOs, or configuration storage.
• I/O Resources: 119 I/O pins to support multiple peripheral interfaces and signal routing in compact boards.
• Power Supply: Single-core supply range from 1.425 V to 1.575 V to match system power rails.
• Package & Mounting: 256-LBGA package (supplier package: 256-FPBGA, 17×17) with surface-mount mounting for standard PCB assembly.
• Operating Range & Grade: Military-grade device with operating temperature from −55 °C to 100 °C, suitable for rugged and high-reliability environments.
• Environmental Compliance: RoHS compliant.

Typical Applications

• Military and Defense Systems — Used for custom logic, I/O interfacing, and control functions where military-grade temperature range and reliability are required.
• Rugged Embedded Control — Implements control algorithms and signal routing in embedded platforms that operate across wide temperature extremes.
• Communications and Data Interface — Provides configurable I/O and on-chip memory for protocol bridging, buffering, and peripheral interfacing.

Unique Advantages

• Balanced Logic and Memory: 13,824 logic elements combined with 110,592 bits of embedded RAM deliver a practical mix of programmable logic and local storage for many embedded functions.
• Substantial I/O Count: 119 I/O pins enable multiple peripheral connections and flexible board-level signal distribution without external multiplexing.
• Military-Grade Operating Range: Qualified for −55 °C to 100 °C operation to meet rugged system requirements.
• Compact, Industry-Standard Package: 256-LBGA (256-FPBGA, 17×17) provides a high-pin-count solution in a compact surface-mount footprint.
• Deterministic Power Supply Window: Narrow supply range (1.425 V–1.575 V) simplifies power sequencing and voltage domain planning.
• RoHS Compliant: Meets environmental compliance for modern manufacturing requirements.

Why Choose AFS600-1FGG256K?

The AFS600-1FGG256K delivers a practical balance of logic capacity, embedded memory, and I/O in a military-grade FPGA package from Microchip Technology’s Fusion family. Its combination of 13,824 logic elements, approximately 0.11 Mbits of on-chip RAM, and 119 I/O pins makes it well suited for rugged embedded designs that require configurable logic and reliable operation across a wide temperature range.

Choose this device for mid-range FPGA projects where military-grade temperature performance, a compact 256-LBGA footprint, and RoHS compliance are important for long-term deployable systems and sustained vendor support.

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