AFS600-1FGG484I

The AFS600-1FGG484I is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial applications. It provides a mid-range programmable logic fabric with 13,824 logic elements and 172 general-purpose I/O pins in a 484-BGA package, delivering programmable integration for control, signal processing and interface functions.

With on-chip RAM, a defined core supply range of 1.425 V to 1.575 V and an industrial operating temperature range of −40 °C to 100 °C, this FPGA is targeted at designs requiring robust thermal performance and a compact surface-mount package.

Key Features

• Logic Capacity  Provides 13,824 logic elements (logic cells) suitable for medium-complexity programmable logic and control tasks.
• Embedded Memory  Includes approximately 0.11 Mbits of on-chip RAM (110,592 bits) for data buffering and small embedded storage needs.
• I/O Density  172 user I/O pins support a variety of external interfaces and signal connectivity in a single device.
• Gate Equivalents  Approximately 600,000 gates of implementation capacity for mapping custom logic and glue functions.
• Power Supply  Core supply voltage range is specified at 1.425 V to 1.575 V for predictable power budgeting and supply design.
• Package & Mounting  484-BGA (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor to save PCB area while offering high pin density.
• Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant  Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Industrial Automation  Programmable control logic and interface consolidation using 13,824 logic elements and 172 I/O within an industrial temperature range.
• Motion and Motor Control  Implements control algorithms and real-time I/O handling while fitting in a compact 484-BGA footprint.
• Factory Instrumentation  Embedded memory and gate capacity enable medium-complexity signal processing and data handling for instrumentation tasks.

Unique Advantages

• Balanced Logic and I/O Density: 13,824 logic elements paired with 172 I/O pins support mixed control and interfacing duties without external glue logic.
• Compact High-Pin-Count Package: 484-BGA (23×23 FPBGA) provides high connectivity in a surface-mount form factor to reduce board area.
• Industrial Ready Thermal Range: Rated from −40 °C to 100 °C for reliable operation in harsher environments and long-term deployments.
• Defined Core Voltage Window: Narrow supply range (1.425 V–1.575 V) simplifies power supply design for stable core operation.
• On-Board RAM for Local Storage: Approximately 0.11 Mbits of embedded memory supports buffering and small data storage without external memory.
• RoHS Compliance: Facilitates lead-free manufacturing and aligns with environmental regulations.

Why Choose AFS600-1FGG484I?

The AFS600-1FGG484I positions itself as a compact, industrial-grade FPGA option that combines medium-scale logic capacity, a high number of I/Os and on-chip RAM in a 484-BGA footprint. It is suited for designers seeking programmability and integration for industrial control, motion systems and instrumentation where thermal robustness and board density matter.

Backed by Microchip Technology manufacturing, this Fusion® FPGA offers predictable supply requirements and RoHS compliance, delivering a stable platform for mid-complexity designs that require long-term reliability and field deployment readiness.

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