AFS600-2FG484

The AFS600-2FG484 is a Fusion® field programmable gate array from Microchip Technology, delivered in a 484-BGA package. It provides a mix of programmable logic, embedded memory and I/O suitable for designs that require on-chip logic density, moderate embedded memory and an extensive I/O count.

With 13,824 logic elements and approximately 0.11 Mbits of embedded memory, this commercial-grade, surface-mount FPGA supports applications that need flexible hardware logic, multiple I/O connections and a compact BGA footprint while operating within a 1.425 V to 1.575 V core supply range and a 0 °C to 85 °C temperature window.

Key Features

• Logic Capacity  13,824 logic elements (cells) and approximately 600,000 gates provide substantial programmable logic resources for custom digital functions and glue logic.
• Embedded Memory  Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for data buffering, small FIFOs and local storage needs.
• I/O Count  172 user I/O pins to support multiple interfaces, sensor connections, peripherals and board-level integration.
• Package and Mounting  484-BGA package (supplier device package: 484-FPBGA, 23 × 23) in a surface-mount form factor for space-efficient board designs.
• Power  Core supply voltage specified from 1.425 V to 1.575 V to match system power rails and design constraints.
• Operating Range  Commercial grade operation across 0 °C to 85 °C for standard commercial environments.
• RoHS Compliance  RoHS compliant to meet lead-free manufacturing requirements.

Typical Applications

• Custom Logic Acceleration  Implement application-specific hardware logic and datapath acceleration using the device’s 13,824 logic elements.
• I/O Aggregation and Protocol Bridging  Use 172 I/O pins to consolidate peripherals, translate interfaces or create protocol bridges on a single FPGA.
• On-Board Data Buffering  Leverage approximately 0.11 Mbits of embedded RAM for buffering, small FIFOs and temporary storage in streaming or control applications.

Unique Advantages

• Balanced Logic and Memory  A combination of 13,824 logic elements and embedded RAM offers a balanced platform for logic-heavy designs that also require local memory.
• High I/O Density  172 available I/O pins reduce external interface components and simplify board-level connectivity.
• Compact BGA Footprint  The 484-FPBGA (23 × 23) package enables a compact board layout while providing substantial pin count for complex designs.
• Commercial-Grade Reliability  Specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial manufacturing environments.
• Defined Power Envelope  A narrow core voltage range (1.425 V to 1.575 V) simplifies power-supply design and integration with system rails.

Why Choose AFS600-2FG484?

The AFS600-2FG484 positions itself as a commercially graded, mid-density Fusion® FPGA that balances logic capacity, embedded memory and a high I/O count in a space-efficient 484-BGA package. It is suited for designers who need to consolidate interfaces, implement custom hardware logic and manage modest on-chip buffering within a clearly defined power and temperature envelope.

For teams focused on compact board layouts and reliable commercial operation, this FPGA provides a clear set of verifiable resources—logic elements, gates, I/O and memory—that simplify design trade-offs and support scalable hardware implementations.

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