AFS600-2FGG484

The AFS600-2FGG484 is a Fusion® Field Programmable Gate Array from Microchip Technology, delivering configurable logic, embedded memory and a substantial I/O complement in a compact BGA package. It targets embedded designs that need a balance of logic capacity, on-chip memory and I/O density within a commercial-grade FPGA footprint.

With 13,824 logic elements (LEs), approximately 110,592 bits of embedded memory, and 172 I/O pins, this device is suited to applications that require medium-scale programmable logic, flexible interfacing and compact surface-mount packaging.

Key Features

• Core Logic — 13,824 logic elements (LEs) providing programmable fabric for custom logic and glue functions.
• Embedded Memory — Approximately 110,592 bits of on-chip RAM for buffering, small data storage or lookup tables.
• Gate Count — 600,000 gates for estimating overall design complexity and integration capability.
• I/O Capacity — 172 user I/O pins to support multiple interfaces and parallel connections.
• Package & Mounting — 484-FPBGA (23 × 23) package, 484-BGA package case, surface-mount mounting for space-efficient board designs.
• Power — Nominal core supply range from 1.425 V to 1.575 V to match system power rails and design constraints.
• Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant, meeting common environmental packaging requirements.

Typical Applications

• Embedded System Prototyping — Use the FPGA to implement custom logic, prototype interfaces and validate system architectures during development.
• I/O Expansion & Interface Bridging — 172 I/Os enable bridging between multiple peripheral buses, parallel interfaces or custom front-end electronics.
• Control and Glue Logic — Implement medium-scale control logic, state machines and timing-critical glue functions using the available logic elements and on-chip RAM.
• Consumer & Commercial Electronics — Compact BGA packaging and commercial-grade temperature range suit space-constrained consumer and commercial products.

Unique Advantages

• Balanced Logic Density: 13,824 logic elements provide a clear capacity point for medium-complexity designs without excess overhead.
• Embedded Memory On-Board: Approximately 110,592 bits of RAM reduce the need for external memory for small buffers and LUT-based functions.
• High I/O Count: 172 I/Os give designers flexibility to connect multiple peripherals and external devices directly to the FPGA fabric.
• Compact Surface-Mount Package: 484-FPBGA (23 × 23) BGA package supports compact board layouts and reliable soldered connections.
• Controlled Power Window: 1.425 V to 1.575 V supply range simplifies power-supply design for the core domain.
• RoHS Compliant: Environmentally compliant packaging supports regulatory requirements for many commercial products.

Why Choose AFS600-2FGG484?

The AFS600-2FGG484 offers a targeted combination of logic capacity, embedded memory and a high I/O count in a compact 484-BGA surface-mount package from Microchip Technology. Its specifications make it a practical choice for designers who need medium-scale programmable logic, direct interfacing capability and a commercial temperature range.

This part is well suited to engineering teams developing consumer and commercial products, prototypes and systems that require reliable, configurable logic with on-chip RAM and a dense I/O complement. RoHS compliance and clearly defined electrical and thermal ranges support predictable integration into production designs.

Request a quote or submit your requirements to get pricing and availability information for the AFS600-2FGG484.