AFS600-FG256
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 119 110592 256-LBGA |
|---|---|
| Quantity | 587 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 119 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of AFS600-FG256 – Fusion® Field Programmable Gate Array (FPGA) IC, 119 I/Os, 256-LBGA
The AFS600-FG256 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology that combines substantial programmable logic capacity with on‑chip memory and a broad complement of I/O. The device provides 13,824 logic elements (cells), approximately 0.11 Mbits of embedded memory (110,592 bits) and an estimated 600,000 gates in a compact 256‑LBGA package.
Designed for surface‑mount assembly, the AFS600‑FG256 operates from a core supply of 1.425 V to 1.575 V and is graded for commercial temperature operation (0 °C to 85 °C). The device is RoHS compliant.
Key Features
- Core Logic Provides 13,824 logic elements (cells) and approximately 600,000 gates for implementing complex programmable logic functions.
- Embedded Memory Includes 110,592 bits of on‑chip RAM (approximately 0.11 Mbits) for local data storage and buffering.
- I/O Count Features 119 I/O pins to support a wide range of external interfaces and system connections.
- Package and Mounting Offered in a 256‑LBGA package (supplier device package: 256‑FPBGA, 17 × 17) and intended for surface‑mount PCB assembly.
- Power Core voltage supply range is 1.425 V to 1.575 V for compatible power‑rail integration.
- Operating Conditions Commercial grade device rated for 0 °C to 85 °C ambient operation.
- Compliance RoHS compliant for regulatory and environmental considerations.
Unique Advantages
- Substantial Logic Capacity: 13,824 logic elements provide ample resources for mid‑range programmable logic implementations without external logic expansion.
- On‑Chip Memory: Approximately 0.11 Mbits of embedded RAM enables local buffering and state storage to simplify system memory architecture.
- Generous I/O: 119 I/Os support multiple external connections and peripheral interfaces from a single device package.
- Compact, Standard Package: 256‑LBGA (256‑FPBGA, 17 × 17) packaging balances board space efficiency with a high pin count for dense designs.
- Low‑Voltage Core: Narrow core supply range (1.425 V–1.575 V) helps with predictable power budgeting and integration into low‑voltage systems.
- Environmentally Compliant: RoHS compliance supports regulatory requirements for lead‑free designs.
Why Choose AFS600-FG256?
The AFS600‑FG256 positions itself as a commercially graded, mid‑range FPGA solution delivering significant logic density, embedded memory, and a broad I/O count in a compact 256‑LBGA footprint. Its specifications suit designs that require integrated programmable logic and on‑chip resources while remaining within commercial temperature and low‑voltage power environments.
With clear electrical and thermal limits and RoHS compliance, the AFS600‑FG256 is a practical option for teams seeking a single‑chip programmable logic element that simplifies board-level integration and helps contain system BOM complexity.
Request a quote or submit a sales inquiry to obtain pricing and availability for the AFS600‑FG256.

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