AFS600-FG484I

IC FPGA 172 I/O 484FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA

Quantity 1,919 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time14 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of AFS600-FG484I – Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA

The AFS600-FG484I is a Fusion® Field Programmable Gate Array (FPGA) IC optimized for industrial embedded applications. It provides substantial programmable logic capacity with 600,000 gates and 13,824 logic elements to implement custom digital functions and control logic.

With 172 I/O pins, approximately 0.11 Mbits of on-chip RAM (110,592 bits), a 484-BGA (484-FPBGA, 23×23) package, and an operating range of -40 °C to 100 °C, this device is suited to industrial systems that require integration of logic, I/O, and embedded memory within a compact surface-mount package. The device core operates from a 1.425 V to 1.575 V supply and is RoHS compliant.

Key Features

  • Core Logic  13,824 logic elements (equivalent to 600,000 gates) provide programmable resources for custom digital designs and control paths.
  • Embedded Memory  Approximately 0.11 Mbits of on-chip RAM (110,592 bits) for buffering, state storage, and small data queues without external memory.
  • I/O Capacity  172 programmable I/O pins to connect sensors, peripherals, and external logic directly to the FPGA fabric.
  • Power  Core supply voltage range of 1.425 V to 1.575 V.
  • Package & Mounting  484-BGA package; supplier device package: 484-FPBGA (23×23); surface-mount mounting for compact PCB integration.
  • Environmental & Grade  Industrial grade device rated for operation from -40 °C to 100 °C and RoHS compliant.

Typical Applications

  • Industrial Control  Implement custom sequencing, motor-control interfaces, and real-time logic where industrial temperature range and robustness are required.
  • Sensor and I/O Aggregation  Aggregate and buffer input from multiple sensors or field devices using 172 I/O lines and on-chip RAM for temporary storage.
  • Embedded Data Processing  Create tailored data paths and protocol handling using the device's logic density and embedded memory for intermediate buffering.
  • Custom Interface Bridging  Develop protocol translators and peripheral interfaces that leverage high I/O count and programmable logic to simplify board-level integration.

Unique Advantages

  • Significant Logic Capacity: 13,824 logic elements and 600,000 gates enable implementation of complex custom logic without external ASICs.
  • On-chip Memory for Buffering: Approximately 0.11 Mbits of embedded RAM reduces the need for external memory in many control and buffering tasks.
  • High I/O Density: 172 I/O pins simplify direct interfacing to multiple peripherals and sensors, reducing external components.
  • Industrial Temperature Range: Rated for -40 °C to 100 °C to support deployment in demanding industrial environments.
  • Compact BGA Footprint: 484-FPBGA (23×23) package balances high pin count with a manageable PCB footprint for space-constrained designs.
  • RoHS Compliant: Meets environmental lead-free requirements for manufacturing.

Why Choose AFS600-FG484I?

The AFS600-FG484I combines substantial programmable logic, on-chip memory, and a high I/O count in an industrial-grade, surface-mount 484-BGA package. Its specifications make it a practical choice for designers building industrial control systems, sensor aggregation gateways, custom interface bridges, and embedded data-processing modules that require both integration and thermal robustness.

For teams seeking a scalable FPGA option that balances logic density, embedded RAM, and robust operating range, the AFS600-FG484I offers a clear platform to consolidate functionality, reduce external BOM, and support long-term deployment in industrial environments.

Request a quote or submit an inquiry for pricing and availability of the AFS600-FG484I to evaluate fit for your next design project.

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