AFS600-FG256K

The AFS600-FG256K is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology designed for military-grade embedded applications. It provides a mid-range logic fabric with on-chip memory and a broad I/O complement in a compact 256-LBGA package, suited for designs that require robustness across extended temperature ranges.

Key Features

• Logic Capacity — Provides 13,824 logic elements (approximately 600,000 gates) for implementing combinational and sequential logic functions.
• Embedded Memory — Includes 110,592 bits of on-chip RAM (approximately 0.11 Mbits) for buffering, state storage, and small data tables.
• I/O Resources — 119 user I/O pins to support a variety of peripheral interfaces and board-level connections.
• Package — 256-LBGA (supplier package: 256-FPBGA, 17 × 17 mm) surface-mount package for compact PCB implementations.
• Power — Core supply range of 1.425 V to 1.575 V to match low-voltage system rails.
• Temperature and Grade — Military-grade device rated for operation from −55 °C to 100 °C for deployment in demanding thermal environments.
• Mounting and Compliance — Surface-mount device declared RoHS compliant.

Typical Applications

• Defense and Military Systems — Implement control logic, glue logic, and protocol interfaces where military-grade temperature performance is required.
• Communications Equipment — Use on-board logic and embedded RAM for signal routing, protocol handling, and I/O management in compact transceiver modules.
• Industrial Control — Deploy for sensor interfacing, deterministic control logic, and peripheral aggregation in rugged industrial environments.
• Embedded Processing — Realize custom state machines, data buffering, and interface bridging within constrained board space using the 256-LBGA package.

Unique Advantages

• Military-Grade Operating Range: Operating from −55 °C to 100 °C supports designs targeted at harsh or wide-temperature environments.
• Balanced Logic and Memory: 13,824 logic elements paired with approximately 0.11 Mbits of embedded RAM enables mid-density logic implementations with on-chip data storage.
• Compact, High-Density Package: The 256-LBGA (17 × 17 mm) package delivers a small board footprint while providing a substantial I/O count.
• Flexible I/O Count: 119 user I/Os allow integration of multiple peripherals and interfaces without immediate external logic.
• Low-Voltage Core: 1.425 V–1.575 V supply compatibility aligns with modern low-voltage system designs to simplify power architecture.
• RoHS Compliant: Environmentally compliant manufacturing status supports procurement and regulatory requirements.

Why Choose AFS600-FG256K?

The AFS600-FG256K positions itself as a reliable mid-density FPGA choice for designs that require military-grade temperature performance, a compact package, and a balanced combination of logic resources and on-chip memory. Its 13,824 logic elements, 119 I/Os, and 256-LBGA footprint make it suitable for embedded systems where board space and environmental robustness are key considerations.

Designed by Microchip Technology, this device is appropriate for engineering teams developing defense, communications, and industrial applications that need a stable supply voltage range and verified RoHS compliance. The AFS600-FG256K delivers predictable hardware capability for projects requiring long-term availability and a clear set of specifications.

Request a quote or submit a sales inquiry to evaluate AFS600-FG256K for your next design and to get pricing, availability, and ordering information.